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Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

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Abstract

Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

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Acknowledgements

The authors would like to gratefully acknowledge financial support from the National Natural Science Foundation of China (Grant No. 51275006), the Bei**g Municipal Natural Science Foundation (Grant No. 3132006), and the Science Research Project of Bei**g Municipal Education Commission (Grant No. KM2012100050010).

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Authors and Affiliations

  1. College of Materials Science and Engineering, Bei**g University of Technology, 100 ** Le Yuan, Chao Yang District, Bei**g, 100124, China

    Qin Li, Yong** Lei, Jian Lin,  HanGuang Fu & Jian Gu

  2. Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, lbaraki, Osaka, 567-0047, Japan

    Ninshu Ma

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  1. Qin Li
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  2. Ninshu Ma
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  3. Yong** Lei
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  4. Jian Lin
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Correspondence to Qin Li or Yong** Lei.

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Li, Q., Ma, N., Lei, Y. et al. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders. J. Electron. Mater. 45, 5800–5810 (2016). https://doi.org/10.1007/s11664-016-4366-z

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