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Electromigration-Induced Void Formation at the Cu5Zn8/Solder Interface in a Cu/Sn-9Zn/Cu Sandwich

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The electromigration that occurs in a Cu/Sn-9Zn/Cu sandwich was investigated for void formation at room temperature with 103 A/cm2. A focused ion beam revealed that voids nucleated at the intermetallic compound (IMC)/solder interface regardless of the electron flow direction. The needle-like voids initiated at the cathode Cu5Zn8/solder interface due to the outward diffusion of Zn atoms in the Zn-rich phase and expanded as a result of the surface diffusion of Sn atoms upon current stressing.

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Acknowledgement

The support of this study by the National Science Council of the Republic of China under Grant NSC94-2216-E-006-014 is gratefully acknowledged.

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  1. Department of Materials Science and Engineering, Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan, 701, Taiwan, ROC

    Shih-Ming Kuo & Kwang-Lung Lin

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  1. Shih-Ming Kuo
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  2. Kwang-Lung Lin
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Correspondence to Shih-Ming Kuo.

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Kuo, SM., Lin, KL. Electromigration-Induced Void Formation at the Cu5Zn8/Solder Interface in a Cu/Sn-9Zn/Cu Sandwich. J. Electron. Mater. 37, 1611–1617 (2008). https://doi.org/10.1007/s11664-008-0512-6

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  • DOI: https://doi.org/10.1007/s11664-008-0512-6

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