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Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates

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Sn-Zn-Bi alloys are promising Pb-free solders. Interfacial reactions between the Sn-8wt.%Zn-3wt.%Bi (Sn-13.80at.%Zn-1.62at.%Bi) alloy and the Cu, Ag, and Ni substrates are examined. Two different kinds of substrates, the bulk plate and the electroplating layer, are used, and the reactions are carried out at 250°C and 220°C. Although the Zn content is only 13.8 at.%, two Zn-Cu compounds, γ-Cu5Zn8 and ε-CuZn5 phases, are formed in the Sn-13.80at.%Zn-1.62at.%Bi/Cu couples. The ε-CuZn5 phase is scallop shaped, and the γ-Cu5Zn8 phase is planar. In the Sn-13.80at.%Zn-1.62at.%Bi/Ag couples, three Zn-Ag compounds are observed, and they are ε-AgZn3, γ-Ag5Zn8, and ζ-AgZn phases. In the Sn-13.80at.%Zn-1.62at.%Bi/Ni couples, a Zn-Ni compound, γ-Ni5Zn21 phase, is formed. Similar results are found in the couples prepared with an electroplating layer: the reaction phases are the same, but the growth rates are different.

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Authors and Affiliations

  1. Department of Chemical Engineering, National Tsing Hua University, #101, Sec. 2, Kuang-Fu Road, Hsin-Chu, 300, Taiwan

    Ching-Feng Yang, Sinn-Wen Chen & Kuan-Hsien Wu

  2. Department of Materials Science and Engineering, National Tsing Hua University, #101, Sec. 2, Kuang-Fu Road, Hsin-Chu, 300, Taiwan

    Tsung-Shune Chin

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  1. Ching-Feng Yang
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  2. Sinn-Wen Chen
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Correspondence to Sinn-Wen Chen.

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Yang, CF., Chen, SW., Wu, KH. et al. Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates. J. Electron. Mater. 36, 1524–1530 (2007). https://doi.org/10.1007/s11664-007-0255-9

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  • DOI: https://doi.org/10.1007/s11664-007-0255-9

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