Simultaneous formation of p- and n-type ohmic contacts to 4H-SiC using the ternary Ni/Ti/Al system

Abstract

Fabrication procedures for silicon carbide power metal oxide semiconductor field effect transistors (MOSFETs) can be improved through simultaneous formation (i.e., same contact materials and one step annealing) of ohmic contacts on both the p-well and n-source regions. We have succeeded with the simultaneous formation of the ohmic contacts for p- and n-type SiC semiconductors by examining ternary Ni/Ti/Al materials with various compositions, where a slash symbol “/” indicates the deposition sequence starting with Ni. The Ni(20 nm)/Ti(50 nm)/Al(50 nm) combination provided specific contact resistances of 2 × 10⁻³ Ω-cm² and 2 × 10⁻⁴ Ω-cm² for p- and n-type SiC, respectively, after annealing at 800°C for 30 min, where the do** level of Al in the SiC substrate was 4.5 × 10¹⁸ cm⁻³ and the level of N was 1.0 × 10¹⁹ cm⁻³.