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Structure Evolution of Slag Films of Ultrahigh-Basicity Mold Flux During Solidification

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Abstract

A higher-basicity mold flux (binary basicity 1.74) for peritectic grades showed similar solidification behavior to conventional high-basicity fluxes. Upon solidification of the mold flux onto a water-cooled copper probe, interfacial roughness at the copper-mold flux interface developed, while the film was glassy. Cuspidine was the major crystalline phase (as for conventional fluxes), but with a lathlike shape, containing some aluminum.

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The authors greatly appreciate support from the members of The Center for Iron and Steelmaking Research at Carnegie Mellon University, the Chongqing Graduate Student Research Innovation Project (CYB14035), and the China Postdoctoral Science Foundation (2016M592119). The authors acknowledge the use of the Materials Characterization Facility at Carnegie Mellon University supported by grant MCF-677785. We are grateful for thermal conductivity measurements performed by Rakesh Dhaka of U.S. Steel Global Process & Materials Development and Engineering.

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Authors and Affiliations

  1. College of Materials Science and Engineering, Chongqing University, Chongqing, 400044, China

    ** He

  2. Center for Iron and Steelmaking Research, Carnegie Mellon University, Pittsburgh, PA, 15213, USA

    **ao Long

  3. Department of Materials Science and Engineering, Center for Iron and Steelmaking Research, Carnegie Mellon University, Pittsburgh, PA, 15213, USA

    P. Chris Pistorius

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  1. **ao Long
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  2. Qian Wang
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  3. Sheng** He
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  4. P. Chris Pistorius
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Correspondence to P. Chris Pistorius.

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Manuscript submitted November 7, 2016.

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Long, X., Wang, Q., He, S. et al. Structure Evolution of Slag Films of Ultrahigh-Basicity Mold Flux During Solidification. Metall Mater Trans B 48, 1938–1942 (2017). https://doi.org/10.1007/s11663-017-1004-y

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  • DOI: https://doi.org/10.1007/s11663-017-1004-y

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