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Dissolution and interface reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb solders on silver base metal

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Abstract

Dissolution and intermetallic compound (IMC) layer development were examined for couples formed between 99.9 silver (Ag) and molten 95.5Sn-3.9Ag-0.6Cu (wt pct), 99.3Sn-0.7Cu, and 63Sn-37Pb solders, using a range of solder temperatures and exposure times. The interface reactions that controlled Ag dissolution were sensitive to the solder composition. The Ag3Sn IMC layer thickness and interface microstructure as a whole exhibited nonmonotonic trends and were controlled primarily by the near-interface solder composition. The kinetics of IMC layer growth were weakly dependent upon the solder composition. The processes of Ag dissolution and IMC layer growth were independent of one another.

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Authors and Affiliations

  1. Sandia National Laboratories, 87123, Albuquerque, NM

    Paul T. Vianco (Principal Member of the Technical Staff), Robert D. Wright (Technologist) & Paul F. Hlava (Member of the Technical Staff)

  2. Orion Inc., Albuquerque, NM

    Joseph J. Martin (Contractor)

Authors
  1. Paul T. Vianco
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  2. Robert D. Wright
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  3. Paul F. Hlava
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  4. Joseph J. Martin
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Vianco, P.T., Wright, R.D., Hlava, P.F. et al. Dissolution and interface reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb solders on silver base metal. Metall Mater Trans A 37, 1551–1561 (2006). https://doi.org/10.1007/s11661-006-0099-6

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  • DOI: https://doi.org/10.1007/s11661-006-0099-6

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