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Creep of tin, Sb-solution-strengthened tin, and SbSn-precipitate-strengthened tin

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Abstract

The creep properties of tin-antimony alloys were studied up to the peritectic composition. For tin at temperatures below approximately 150 °C, creep is dominated by pipe diffusion-controlled climb with a stress exponent of 8 and activation energy of 70 kJ/mol. At high stresses, small amounts of impurities cause a transition to a less stress sensitive, most likely solute drag-controlled mechanism. Antimony atoms in solution have only a minor effect on these creep properties. Alloys with higher compositions of antimony contain whiskerlike SbSn precipitates. These alloys exhibit a discontinuous transition in stress exponent and activation energy at an intermediate stress. The creep behavior of these alloys is described fairly well by a composite theory in which the power law stress is divided by a strengthening coefficient, and the strengthening coefficient is related to the precipitate volume fraction and the aspect ratio. Using a friction stress and a strengthening coefficient simultaneously, the behavior of these alloys can be described entirely in terms of tin creep constants. Aging at 100 °C has little effect on the creep properties of the precipitation-strengthened alloys. It is expected that solder alloys strengthened by these precipitates would maintain a significant fraction of their creep strength for significant periods at temperatures below 100 °C.

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Authors and Affiliations

  1. the MST-8 Structure/Property Relation Group, Division of Materials Science and Technology, Los Alamos National Laboratory, 87545, Los Alamos, NM

    Rodney J. McCabe (Postdoctor)

  2. the Department of Materials Science and Engineering, Northwestern University, 60208, Evanston, IL

    Morris E. Fine (Walter D. Murphy Professor)

Authors
  1. Rodney J. McCabe
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  2. Morris E. Fine
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McCabe, R.J., Fine, M.E. Creep of tin, Sb-solution-strengthened tin, and SbSn-precipitate-strengthened tin. Metall Mater Trans A 33, 1531–1539 (2002). https://doi.org/10.1007/s11661-002-0075-8

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  • DOI: https://doi.org/10.1007/s11661-002-0075-8

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