Log in

Influences of ZrO2 nano-particles on the microstructures and microhardness of Sn8Zn1Bi–xZrO2/Cu solder joints

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

ZrO2 nano-particles reinforced Sn8Zn1Bi–xZrO2 (x = 0.25, 0.5 and 1) composite solder balls were prepared by a mechanical mixing method and then they were reflowed on Cu substrates. The influences of ZrO2 nano-particles on the microstructures and microhardness of the composite solder joints was investigated. Zn-rich phase was refined in the SnZnBi–xZrO2 composite solder matrices due to the adsorption of the ZrO2 nano-particles on them. The refined Zn-rich phase increased the microhardness of the composite solder matrices. Furthermore, the adsorption effect of ZrO2 nano-particles to the SnZnBi–xZrO2/Cu interface suppressed the growth of intermetallic compound (IMC) layers by decreasing the growth driving force of them. However, Zn atoms were impeded from gathering on the SnZnBi–xZrO2/Cu interfaces to form Cu5Zn8 phase due to the refinement of Zn-rich phase. Therefore, this gave excessive growth of the Cu6Sn5 IMC layer.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Subscribe and save

Springer+ Basic
EUR 32.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or Ebook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Price includes VAT (Germany)

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6

Similar content being viewed by others

References

  1. M. Abtew, G. Selvaduray, Lead-free solders in microelectronics. Mater. Sci. Eng., R 27, 95–141 (2000)

    Article  Google Scholar 

  2. F. Guo, Composite lead-free electronic solders. J. Mater. Sci.: Mater. Electron. 18, 129–145 (2007)

    Article  CAS  Google Scholar 

  3. J.X. Jiang, J.E. Lee, K.S. Kim, K. Suganuma, Oxidation behavior of Sn-Zn solders under high-temperature and high-humidity conditions. J. Alloys Compd. 462, 244–251 (2008)

    Article  CAS  Google Scholar 

  4. J. Chen, J. Shen, D. Min, C. Peng, Influence of minor Bi additions on the interfacial morphology between Sn–Zn–xBi solders and a Cu layer. J. Mater. Sci.: Mater. Electron. 20, 1112–1117 (2009)

    Article  CAS  Google Scholar 

  5. L.L. Duan, D.Q. Yu, S.Q. Han, H.T. Ma, L. Wang, Microstructural evolution of Sn–9Zn–3Bi solder/Cu joint during long-term aging at 170 °C. J. Alloys Compd. 381, 202–207 (2004)

    Article  CAS  Google Scholar 

  6. J. Shen, Y.C. Chan, Research advances in nano-composite solders. Microelectron. Reliab. 49, 223–234 (2009)

    Article  CAS  Google Scholar 

  7. J. Shen, Y.C. Liu, Y.J. Han, Y.M. Tian, H.X. Gao, Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn–3.5Ag lead-free solder. J. Electron. Mater. 35, 1672–1679 (2006)

    Article  CAS  Google Scholar 

  8. J. Shen, Y.C. Chan, Effects of ZrO2 nanoparticles on the mechanical properties of Sn-Zn solder joints on Au/Ni/Cu pads. J. Alloys Compd. 477, 552–559 (2008)

    Article  Google Scholar 

  9. H. Hao, J. Tian, Y.W. Shi, Y.P. Lei, Z.D. **a, Properties of Sn3.8Ag0.7Cu solder alloy with trace rare earth element Y additions. J. Electron. Mater. 36, 766–774 (2007)

    Article  CAS  Google Scholar 

  10. J. Zhou, Y. Sun, F. Xue, Properties of low melting point Sn–Zn–Bi solders. J. Alloys Compd. 397, 260–264 (2005)

    Article  CAS  Google Scholar 

  11. C.F. Peng, J. Shen, W.D. **e, J. Chen, C.P. Wu, X.C. Wang, Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate. J. Mater. Sci.: Mater. Electron. 22, 797–806 (2011)

    Article  CAS  Google Scholar 

  12. B. Li, Y.W. Shi, Y.P. Lei, F. Guo, Z.D. **a, B. Zong, Effect of rare earth element addition on the microstructure of Sn–Ag–Cu solder joint. J. Electron. Mater. 34, 217–224 (2005)

    Article  Google Scholar 

  13. Z.D. **a, Z.G. Chen, Y.W. Shi, N. Mu, N. Sun, Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder. J. Electron. Mater. 31, 564–567 (2002)

    Article  CAS  Google Scholar 

  14. D. Lin, G.X. Wang, T.S. Srivatsan, M. AlHajri, M. Petraroli, The influence of copper nanopowders on microstructure and hardness of lead-tin solder. Mater. Lett. 53, 333–338 (2002)

    Article  CAS  Google Scholar 

  15. D. Lin, G.X. Wang, T.S. Srivatsan, M. AlHajri, M. Petraroli, Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin-lead solder. Mater. Lett. 57, 3193–3198 (2003)

    Article  CAS  Google Scholar 

  16. P. Liu, P. Yao, J. Liu, Effect of SiC nanoparticle additions on microstructure and microhardness of Sn–Ag–Cu solder alloy. J. Electron. Mater. 37(6), 874–879 (2008)

    Article  CAS  Google Scholar 

  17. F. Tai, F. Guo, Z.D. **a, Y.P. Lei, Y.W. Shi, Effects of nano-structured particles on microstructure and microhardness of Sn-Ag solder alloy. J. Mater. Sci.: Mater. Electron. 21, 702–707 (2010)

    Article  CAS  Google Scholar 

  18. H. Mughrabi, Plastic Deformation and Fracture of Materials (VCH, New York, 1993), pp. 315–322

    Google Scholar 

Download references

Acknowledgments

This research was financial supported by a Fundamental Research Funds for the Central Universities of P R China (Project No. CDJZR10130010) and a Fundamental Research Funds for the Central Universities (Project No. CDJXS10131155).

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Jun Shen.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Peng, C., Shen, J. & Yin, H. Influences of ZrO2 nano-particles on the microstructures and microhardness of Sn8Zn1Bi–xZrO2/Cu solder joints. J Mater Sci: Mater Electron 24, 203–210 (2013). https://doi.org/10.1007/s10854-012-0711-z

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-012-0711-z

Keywords

Navigation