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Interfacial Stress Intensity Factors for Edge-Cracked Bonded Semicircles and Strips Under Out-of-Plane Shear

  • Letters in Fracture and Micromechanics
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Abstract

Analytical expressions of the mode III interfacial stress intensity factor are derived for the edge-cracked problems in bonded semicircles and strips. The results are extracted from the solutions of the bonded finite sector by the conformal map** method. Based on the method, the stress intensity factors for the problems with various crack lengths are achieved, and two corresponding cases are presented and discussed. The obtained solutions can serve as a reference for related crack problems.

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Authors and Affiliations

  1. Institute of Applied Mechanics, National Taiwan University, Taipei, 106, Taiwan

    Chih-Hao Chen

  2. Geotechnical Engineering Research Center, Sinotech Engineering Consultants, Inc., Taipei, 110, Taiwan

    Chien-Chung Ke

  3. Department of Resources Engineering, National Cheng Kung University, Tainan, 701, Taiwan

    Chein-Lee Wang

Authors
  1. Chih-Hao Chen
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  2. Chien-Chung Ke
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  3. Chein-Lee Wang
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Correspondence to Chih-Hao Chen.

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Chen, CH., Ke, CC. & Wang, CL. Interfacial Stress Intensity Factors for Edge-Cracked Bonded Semicircles and Strips Under Out-of-Plane Shear. Int J Fract 180, 119–127 (2013). https://doi.org/10.1007/s10704-012-9797-9

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  • DOI: https://doi.org/10.1007/s10704-012-9797-9

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