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Study on laser ablation of glass using MHz-to-GHz burst pulses

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Abstract

The authors report on the use of a burst-mode ultrashort pulsed laser source with an emitting wavelength of 1030 nm on to micro-machining plane areas of glass with different pulse durations, burst energies, and number of sub-pulses per burst with intra-burst rates of 65 MHz and 2.5 GHz. In the investigated parameter range, the maximum specific removal rates are obtained with \(11.2\,\upmu \text{m}^{3}/\upmu \text{J}\) for MHz bursts and \(27.0\,\upmu \text{m}^{3}/\upmu \text{J}\) for GHz bursts, being up to four times higher compared to the non-burst regime. The depth per scan and the surface roughness increase at higher burst energies and at a higher number of sub-pulses per burst, respectively. Furthermore, a significant difference in the resulting surface topography between MHz and GHz bursts is shown by SEM images, mainly depending on the number of sub-pulses per burst.

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All data investigated through this study are included in this manuscript.

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Acknowledgements

The authors gratefully acknowledge financial support by the European Social Fund for Germany (ESF) in the funding project EilaSax no. 1003 395 06 and Qualitätsoptimierter Hochrateabtrag no. 1003 606 36. Furthermore, the authors acknowledge ACSYS Lasertechnik GmbH for providing the laser beam source and assisting with the experiments.

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  1. Department of Physics and Laser Technology, University of Applied Sciences Mittweida, Technikumplatz 17, 09648, Mittweida, Germany

    Daniel Metzner, Peter Lickschat & Steffen Weißmantel

  2. Department of Materials and Surface Engineering, Chemnitz University of Technology, 09107, Chemnitz, Germany

    Daniel Metzner & Thomas Lampke

  3. ACSYS Lasertechnik GmbH, 09648, Mittweida, Germany

    Christian Kreisel

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Metzner, D., Lickschat, P., Kreisel, C. et al. Study on laser ablation of glass using MHz-to-GHz burst pulses. Appl. Phys. A 128, 637 (2022). https://doi.org/10.1007/s00339-022-05776-7

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