Abstract
The aim of this article is to provide a systematic method to investigate characteristics of interfacial heat transport in electronic packaging. A multi-scale model is proposed for the interfacial thermal conductance. The approach is a mixed modeling method using molecular dynamics simulation and a finite-element method. The molecular dynamics simulation is the means for describing the critical regions within the system and the finite-element method is the means for a continuum description of the remainder of the system. Applying various boundary conditions to the atomic model is rather cumbersome. In this mixed model, the continuum subdomain serves primarily as a boundary model that provides the low-frequency impedance and a sink for the energy associated with outgoing waves of the molecular dynamics model. Then, boundary conditions can be applied to the finite-element model more easily. Some simulation results can be obtained for investigation of characteristics of interfacial heat transport between dissimilar materials in electronic packaging. The research establishes a new theoretical basis for engineering design and future work.
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02.70.Ns; 02.70.Dh; 02.60.Cb; 62.25.-g; 68.35.-p; 81.07.Nb; 85.85.+j; 44.00.00; 44.05.+e; 46.05.+b; 81.05.Bx
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Yang, P., Liao, N. Research on characteristics of interfacial heat transport between two kinds of materials using a mixed MD–FE model. Appl. Phys. A 92, 329–335 (2008). https://doi.org/10.1007/s00339-008-4521-3
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DOI: https://doi.org/10.1007/s00339-008-4521-3