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Open-source wire and arc additive manufacturing system: formability, microstructures, and mechanical properties

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Abstract

The inexpensive cost and high manufacture efficient metal wire and arc additive manufacturing (WAAM) system was designed in this work. Its application potential was evaluated from the three aspects of formability, microstructures, and mechanical properties. By using compulsory cooling solution implemented in the open-source WAAM system, the complex-shaped metal parts were deposited completely with no obvious defects, such as cracks, pores, or incomplete fusion. The properties of the WAAM part were evaluated by optical microscopy (OM), scanning electron microscopy (SEM), microhardness, and microtensile test. The results indicate that the formability of metal parts fabricated by the open-source WAAM system was improved by using compulsory cooling solution. The microstructures of the WAAM part are exhibited as granular structure which consisted of the granular ferrite and the residual austenite interspersed with a little pearlite in the intermediate zone. And the average ferrite grain size of non-overlap** layer is relatively smaller than that of overlap** layer. The specimen perpendicular to the building direction exhibits a better mechanical property.

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Authors and Affiliations

  1. College of Mechanical Engineering, Yanshan University, Qinhuangdao, 066004, People’s Republic of China

    X. Lu, Y. F. Zhou, L. Y. Shao & S. Y. Gao

  2. State Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao, 066004, People’s Republic of China

    X. L. **ng & Q. X. Yang

Authors
  1. X. Lu
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  2. Y. F. Zhou
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  3. X. L. **ng
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  4. L. Y. Shao
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  5. Q. X. Yang
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  6. S. Y. Gao
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Correspondence to Y. F. Zhou or S. Y. Gao.

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Lu, X., Zhou, Y.F., **ng, X.L. et al. Open-source wire and arc additive manufacturing system: formability, microstructures, and mechanical properties. Int J Adv Manuf Technol 93, 2145–2154 (2017). https://doi.org/10.1007/s00170-017-0636-z

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  • DOI: https://doi.org/10.1007/s00170-017-0636-z

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