Abstract
Silicon wafer slicing is a complex manufacturing process, complicating efforts to monitor process stability and quality control effectively. However, silicon wafer slicing involves several synchronously occurring multiple quality characteristics that require close monitoring and control. Therefore, this study applies the Chinese philosophy of yin and yang to illustrate relative management and control wafer slicing quality, and provides decision makers with philosophical thoughts for balancing the simultaneous consideration of various factors. Furthermore, to increase process yield and accurately forecast the next wafer slice quality, grey forecasting is applied to constantly and closely monitor slicing machine drift and quality control.
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Lin, CT., Chang, CW. & Chen, CB. Relative control philosophy – balance and continual change for forecasting abnormal quality characteristics in a silicon wafer slicing process. Int J Adv Manuf Technol 26, 1109–1114 (2005). https://doi.org/10.1007/s00170-004-2067-x
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DOI: https://doi.org/10.1007/s00170-004-2067-x