SpringerLink
Log in

The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solder

  • Published:
Journal of Materials Science Aims and scope Submit manuscript

Abstract

The mechanical properties and microstructures ofcopper and brass soldered with eutectic tin-bismuth solder have been determined and the joints examined using metallographic techniques. Joints made with copper were stronger than those made with brass. At the copper/solder interface a uniform layer 2μm thick of Cu5.2Sn5 was formed and at the brass/solder interface a uniform layer 2 μm thick of (Cu, Zn)2.9Sn and an irregular layer 2 to 5μm thick of (Cu, Zn)5.7Sn5 were formed. Copper joints fractured etthocopper/solder interface and brass joints fractured in the internmetalic layer. Copper joints soldered with eutectic Sn-Bi were stronger than copper joints soldered with eutectic Sn-Pb and the reverse was true for brass joints. Results are also given for the effect of thermal shock on copper and brass joints soldered with Sn-Bi and Sn-Pb solders, and also for We fatigue and creep behaviour of joints soldered with eutectic Sn-Bi solder.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Subscribe and save

Springer+ Basic
EUR 32.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or Ebook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Price includes VAT (Thailand)

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. V. R. Allies, Proceedings National Electronic Packaging Conference, Anaheim, California, 1981 (Kiver Communications, Surbiton, Surrey, 1981) p. 575.

    Google Scholar 

  2. P. W. Schuessler,ibid. (Kiver Communications, Surbiton, Surrey, 1980) p. 45.

    Google Scholar 

  3. R. J. Klein Wassink, “Soldering in Electronics” (Electrochemical Publications, Ayr, 1984) p.83.

    Google Scholar 

  4. C. A. Mackay andW. D. Von Voss,Mater. Sci. Technol. 1 (1985) 240.

    Google Scholar 

  5. W. J. Tomlinson andN. J. Bryan,J. Mater, Sci. 21 (1986) 103.

    Google Scholar 

  6. W. J. Tomlinson andG. A. Cooper,ibid. 21 (1986) 1730.

    Google Scholar 

  7. F. A. Mohamed andT. G. Langdon,Phil. Mag. 32 (1975) 697.

    Google Scholar 

  8. E. Baker,Mater. Sci. Engng. 38 (1979) 241.

    Google Scholar 

  9. U. P. Singh andH. D. Merchant,Met. Trans. 4A (1973) 2621.

    Google Scholar 

  10. A. G. Atkins, A. Silverio andD. Tabor,J. Inst. Metals 44 (1966) 369.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Materials, Coventry Polytechnic, CV1 5FB, Coventry, UK

    W. J. Tomlinson & I. Collier

Authors
  1. W. J. Tomlinson
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. I. Collier
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Tomlinson, W.J., Collier, I. The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solder. J Mater Sci 22, 1835–1839 (1987). https://doi.org/10.1007/BF01132413

Download citation

  • Received:

  • Accepted:

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF01132413

Keywords

Search

Navigation