SpringerLink
Log in

Room temperature tensile properties of Sn-5%Sb solder

  • Published:
Journal of Materials Science Letters

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Subscribe and save

Springer+ Basic
EUR 32.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or Ebook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Price includes VAT (Germany)

Instant access to the full article PDF.

Institutional subscriptions

References

  1. S. **, J. Metals 45 (1993) 13.

    Google Scholar 

  2. D. Hanson and E. J. Sanford, J. Inst. Metals 59 (1936) 159.

    Google Scholar 

  3. Idem., ibid. 62 (1938) 215.

    Google Scholar 

  4. J. Hwang, in “Electronics packaging and interconnection handbook” (McGraw-Hill, New York, 1991).

    Google Scholar 

  5. P. T. Vianco and D. R. Frear, J. Metals 45 (1993) 14.

    Google Scholar 

  6. J. S. Hwang, “Solder paste in electronics packaging” (Van Nostrand Reinhold, New York, 1989).

    Google Scholar 

  7. W. R. Lewis, Notes on soldering (Tin Research Inst., Middlesex, England, 1959).

    Google Scholar 

  8. J. L. Christian, Electro-technology 6 (1963) 109.

    Google Scholar 

  9. H. H. Manko, “Solders and soldering” (McGraw-Hill, New York, 1964).

    Google Scholar 

  10. F. J. Dunkerly, H. B. Hunter and F. G. Stone, J. Metals 185 (1949) 1005.

    Google Scholar 

  11. G. Simmons and H. Wang, “Single crystals constants and calculated aggregate properties” (MIT Press, Cambridge, MA. 1971).

    Google Scholar 

  12. W. Betteridge and A. W. Franklin, J. Inst. Metals 80 (1951–52) 147.

    Google Scholar 

  13. O. D. Sherby and P. M. Burke, Prog. Mater. Sci. 13 (1967) 325.

    Google Scholar 

  14. R. J. Lederich, P. J. Meschter and S. M. L. Sastry, in “Rapidly solidified aluminum alloys: ASTM STP 890” (American Society for Testing of Materials, Philadelphia, PA, 1986).

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. High Performance Materials, Inc., Washington University, Campus Box 1087, 63130, St. Louis, MO, USA

    R. K. Mahidhara

  2. Materials Research Laboratory, Washington University, 63130, St. Louis, MO, USA

    S. M. L. Sastry & K. L. Jerina

  3. Microelectronics Center of North Carolina, P.O. Box 12889, 27709, Research Triangle Park, NC, USA

    I. Turlik

  4. North Carolina State University, P.O. Box 7909, 27695, Raleigh, NC, USA

    K. L. Murty

Authors
  1. R. K. Mahidhara
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. S. M. L. Sastry
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. K. L. Jerina
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. I. Turlik
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. K. L. Murty
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Mahidhara, R.K., Sastry, S.M.L., Jerina, K.L. et al. Room temperature tensile properties of Sn-5%Sb solder. JOURNAL OF MATERIALS SCIENCE LETTERS 13, 1387–1389 (1994). https://doi.org/10.1007/BF00405039

Download citation

  • Received:

  • Accepted:

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF00405039

Keywords

Search

Navigation