Abstract
Beidou chip plays an important role in monitoring overhead transmission line tower deformation and gallo** [2], but the corona discharge, caused by large electric field on the surface of transmission line tower and nearby the Beidou chip, have an impact on the operational reliability of Beidou chip. It is of great significance to get an accurate calculation, which is important to the chip safety and monitoring equipment operation reliability. According to the actual 500 kV tower parameters, the finite element simulation model of electrostatic field is established. Based on the finite element method, the electric field strength of the tower and the chip surface is computed. Based on the simulation results, the effects of installation position and protective materials on the electric field are discussed. By changing the parameters of the box and the arrays, shapes, and spacing of the aperture, the electric field strength distribution under different conditions is obtained. Research results show that when the box is made of glass fiber reinforced plastic (GRP) and the aperture array is designed as 4 × 4, with a total area of 800 mm2, the electric field strength on the chip surface is about 471.7 V/m. This design can provide some guidance for the reliable operation of Beidou chip and the normal operation of transmission line monitoring.
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Wang, Y., Huang, D. (2023). Research on the Operation Reliability of Beidou Chip Considering the Electric Field of Transmission Line Tower. In: Dai, D., Zhang, C., Fang, Z., Lu, X. (eds) Proceedings of the 4th International Symposium on Plasma and Energy Conversion. ISPEC 2022. Springer Proceedings in Physics, vol 391. Springer, Singapore. https://doi.org/10.1007/978-981-99-1576-7_49
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DOI: https://doi.org/10.1007/978-981-99-1576-7_49
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