Abstract
The development in CPUs and GPUs to increase their computational power has also resulted in increase in heat generated by them, and with the current demand of miniaturizing electronic devices, the space available to dissipate the heat generated is limited. Therefore, the need is to incorporate new methods to design a heat sink which can dissipate more heat in the limited space available. Use of perforated pin fins can be one such method as it increases the heat dissipation rate and occupies equal volume to that of solid pin fins. In the present study, forced convective flow of air over staggered pin fin array is analyzed computationally. In order to analyze the effect of perforation density, four perforation pitches are considered, and their performance is compared with the solid pin fin heat sink over a wide range of Reynolds number ranging from 8000 to 22,000. It has been observed that the heat transfer rate has been augmented due to the increased heat transfer area on account of using perforated fins, while the pressure drop across the heat sink is reduced which can be attributed to the lesser obstruction to flow of air.
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Abbreviations
- D :
-
Pin diameter (mm)
- D h :
-
Hydraulic diameter of rectangular channel (mm)
- D p :
-
Diameter of perforation (mm)
- k air :
-
Thermal conductivity of air (W m−1 K−1)
- ρ :
-
Density of air (kg/m3)
- µ :
-
Viscosity of air (Kg m−1s−1)
- Nu:
-
Nusselt number
- ∆P :
-
Pressure drop across test section (Pa)
- η :
-
System performance
- η ratio :
-
Performance ratio
- Re h :
-
Reynolds number based on hydraulic diameter
- u o :
-
Inlet velocity (ms−1)
- T in :
-
Inlet temperature (°C)
- T out :
-
Outlet temperature (°C)
- T w :
-
Average base plate temperature (°C)
- q 00 :
-
Heat flux (Wm−2)
- P p :
-
Perforation pitch (mm)
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Gaur, M., Arora, A. (2023). Integration of Perforations in Conventional Heat Sinks for Augmented Heat Dissipation. In: Sharma, D., Roy, S. (eds) Emerging Trends in Energy Conversion and Thermo-Fluid Systems. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-19-3410-0_6
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