Study on Preparation and Performance of Thermal Expansion Fluorescent Ink

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Interdisciplinary Research for Printing and Packaging

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 896))

Abstract

Thermal Expansion fluorescent ink has the advantages of strong adhesion, easy processing, low cost, etc., and can be used in securities anti-counterfeiting, functional clothing and other fields. In this study, an in-situ polymerization method was used to synthesize thermally expandable microcapsules (TEMs) with n-hexane as the core material and acrylonitrile (AN), methyl methacrylate (MMA) and methyl acrylate (MA) monomers as the wall material. Thermally expandable microcapsules, binders, color paste and fluorescent materials are mixed in a certain proportion to prepare an ink with three-dimensional and fluorescent functions. The ink is transferred to different substrates by screen printing, meanwhile, the surface morphology, adhesion and other properties of the fluorescent ink are tested with laser confocal microscope, ISO 12944 international standard cross-cut method and other instruments. The research results show that the ink is evenly distributed on different substrates, has good film-forming properties and strong adhesion. Therefore, the foaming fluorescent ink can beautify the product and has an anti-counterfeiting effect, which develop the application of functional ink.

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Acknowledgements

This work was supported by the Key Scientific Research Project of Bei**g Municipal commission of Education (KZ201910015016), the National Natural Science Foundation of China (21776021), the BIGC Key Project (Ec202004), and the Cross training Plan for High Level Talents in Bei**g.

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Correspondence to Zhich eng Sun .

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Yang, Z., Sun, Z.e., Li, Z., Li, G. (2022). Study on Preparation and Performance of Thermal Expansion Fluorescent Ink. In: Zhao, P., Ye, Z., Xu, M., Yang, L., Zhang, L., Yan, S. (eds) Interdisciplinary Research for Printing and Packaging. Lecture Notes in Electrical Engineering, vol 896. Springer, Singapore. https://doi.org/10.1007/978-981-19-1673-1_61

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  • DOI: https://doi.org/10.1007/978-981-19-1673-1_61

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-19-1672-4

  • Online ISBN: 978-981-19-1673-1

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