The Process Technology of the Shell for an Digital Array Module with Embedded Liquid Cooling Plate

Abstract

The electronic module is the core component of the radar. The Shell of an Digital Array Module is the carrier to realize high precision interconnection of telecommunication. With the integration of electronic components level getting higher, the thermal dissipation of the digital array module will reach kilowatt level and the limiting heat flux may exceed 500 W/cm². Therefore, the high heat flux cooling technology is urgently needed to reduce the module ambient temperature. In this paper, the structural features and processing requirements of the electric module shell were carefully analyzed. And, the key technique of the micro channel forming was systematically studied. Simultaneously, the integration manufacturing and the true application results were introduced in detail. The electronic module realized enhanced heat dissipation through micro channel supplied liquid by the main channel. So, the channels forming scheme were designed and machined to meet the needs of thermal control. The high speed cutting method was determined through detailed process design, anti-deformation clam** and machining design to achieve high accurate requirement. The electronic module manufactured according to the proposed technological method, process control and key technical points exhibit well properties in terms of accuracy, thin-wall, large size and rigidity. These properties have been verified through coordinate measurement, nondestructive testing of welding surface, the pressure test of the micro channels, electronic device assembling and electrical measurement. The first batch of 56 samples assembling in products exhibited excellent performance which was reflected by the stability of the equipment function.