Abstract
Microwave multilayer-PCB is a special kinds of printed circuit board (PCB), which using increasing fast in field and quantity in electronics products such as communication equipment, RADAR, and etc. Usually the base material of microwave multilayer-PCB is PTFE based microwave laminates. Because of the special specification of PTFE, the defects such as weak bonding or delaminate are inevitable. So it is very necessary to pick out unqualified pieces depend on nondestructive testing method. In this paper, the research result and application of ultrasonic testing technology using in microwave multilayer-PCB manufacturing are introduced.
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References
Xu, C., Li, W.: Nondestructive Testing Ultrasonic Theory, 1st edn. Science Press, Bei**g (2020)
Yang, W.: Fabrication technique of microwave multilayer printed circuit board. Electron. Compon. Device Appl. 6(1), 52–54 (2001)
**e, Y.: Application of ultrasonic testing technology in aviation composite materials and component inspection. In: The 1st Aviation Support Equipment Development Forum, pp. 196–200 (2017)
Zhou, Z., Li, W.: Development and application of advanced ultrasonic testing technology in aerospace. Aeronaut. Manuf. Technol. 61(19), 34–44 (2018)
Wei, Q., **, C., Zhou, J., Zhou, Z., Sun, G.: Application of air-coupled ultrasonic technology for nondestructive testing of aerospace composites. Nondestr. Test. 38(8), 6–11 (2016)
Liu, Z., et al.: Research on immersion ultrasonic testing technology of 3D printed titanium alloy parts. Nondestr. Test. Technol. 44(4), 20–23 (2020)
Zhou, Z., Sun, G.: New progress of the study and application of advanced ultrasonic testing technology. J. Mech. Eng. 53(22), 1–7 (2017)
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Chen, X., Tao, L., Shang, J., Liu, D. (2022). Application Research of Ultrasonic Testing in Microwave Multilayer PCB. In: Duan, B., Umeda, K., Kim, Cw. (eds) Proceedings of the Eighth Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 885. Springer, Singapore. https://doi.org/10.1007/978-981-19-1309-9_183
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DOI: https://doi.org/10.1007/978-981-19-1309-9_183
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Publisher Name: Springer, Singapore
Print ISBN: 978-981-19-1308-2
Online ISBN: 978-981-19-1309-9
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