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Extension of Surface/Bulk Micromachining: One-Mask Fabrication Technology Enabling the Integration of 6-DoF Inertial Sensors on a Single Wafer

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Transducers ’01 Eurosensors XV

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Summary

In this paper, a new technology that enables the fabrication of single-crystal silicon microstructures capable of detecting the vertical motion without a bottom electrode is presented. The vertical-motion sensing is realized by fabricating a quasi-vertical comb electrode. The quasi-vertical comb electrode is fabricated by utilizing the RIE lag phenomenon. This vertical sensing scheme allows the integration of 6-DoF inertial sensors on a single wafer. The developed process for vertical electrodes is very simple and needs only one mask. Currently work is underway to test the performance of the fabricated inertial sensor.

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Author information

Authors and Affiliations

  1. MEMS Laboratory, Samsung Advanced Institute of Technology (SAIT), San #14, P. O. Box #111, Suwon, 440-600, Korea

    Sangwoo Lee, Byeung-Leul Lee, Kyu Dong Jung, Joon Hyock Choi, Taek-Ryong Chung & Yong Chul Cho

Authors
  1. Sangwoo Lee
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  2. Byeung-Leul Lee
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  3. Kyu Dong Jung
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  4. Joon Hyock Choi
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  5. Taek-Ryong Chung
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  6. Yong Chul Cho
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Editor information

Editors and Affiliations

  1. Department of Electrical Engineering & Computer Science Microsensor & Actuator Technology Secr.TIB 3.1, Berlin University of Technology, Gustav-Meyer-Allee 25, D-13355, Berlin, Germany

    Ernst Obermeier

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© 2001 Springer-Verlag Berlin Heidelberg

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Lee, S., Lee, BL., Jung, K.D., Choi, J.H., Chung, TR., Cho, Y.C. (2001). Extension of Surface/Bulk Micromachining: One-Mask Fabrication Technology Enabling the Integration of 6-DoF Inertial Sensors on a Single Wafer. In: Obermeier, E. (eds) Transducers ’01 Eurosensors XV. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-59497-7_262

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  • DOI: https://doi.org/10.1007/978-3-642-59497-7_262

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-42150-4

  • Online ISBN: 978-3-642-59497-7

  • eBook Packages: Springer Book Archive

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