Abstract
A meshless local Petrov-Galerkin (MLPG) method to analyse the electro-elastic response of functionally graded piezoelectric circular sensor is proposed. In this approach the analysed body is discretized using nodal points only, no finite element mesh is required. The moving least-squares (MLS) scheme is employed for the spatial approximation of unknown physical fields in terms of corresponding nodal quantities. Three-dimensional modelling enables asymmetric loading patterns to be used. The exponential gradation of material properties is proposed in the poling direction of the sensor. The effect of varying gradation coefficients on mechanical displacements and induced electric potential is investigated.
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References
Suresh, S., Mortensen, A.: Fundamentals of Functionally Graded Materials. Institute of Materials, London (1998)
Tiersten, H.F.: Linear Piezoelectric plate vibrations. Plenum Press, New York (1969)
Allik, H., Hughes, T.J.R.: Finite element method for piezoelectric vibration. International Journal for Numerical Methods in Engineering 2, 151–157 (1970)
Hwang, W., Parkt, H.: Finite element modeling of piezoelectric sensors and actuators. Sens. Actuators A 5, 930–937 (1993)
Benjeddou, A.: Advances in piezoelectric finite element modeling of adaptive structural elements: a survey. Computers and Structures 76, 347–363 (2000)
Atluri, S.N.: The meshless method (MLPG) for domain & BIE discretizations. Tech Science Press, Forsyth (2004)
Sladek, J., Sladek, V., Zhang, C., Garcia-Sanchez, F., Wunsche, M.: Meshless Local Petrov-Galerkin Method for Plane Piezoelectricity. CMC: Computers, Materials & Continua 4(2), 109–117 (2006)
Sladek, J., Sladek, V., Stanak, P., Pan, E.: The MLPG for bending of electroelastic plates. CMES – Computer Modeling in Engineering & Sciences 64, 267–298 (2010)
Stanak, P., Sladek, J., Sladek, V., Krahulec, S.: Composite circular plate analyzed as a 3-D axisymmetric piezoelectric solid. Building Research Journal 59(3-4), 125–140 (2011)
Sladek, J., Sladek, V., Stanak, P., Wen, P.H., Atluri, S.N.: Laminated elastic plates with piezoelectric sensors and actuators. CMES – Computer Modeling in Engineering and Sciences 85, 543–572 (2012)
Sladek, J., Sladek, V., Zhang, C.: Stress analysis in anisotropic functionally graded materials by the MLPG method. Eng. Anal. Bound. Elem. 29, 597–609 (2005)
Sladek, J., Sladek, V., Solek, P.: Elastic analysis in 3D anisotropic functionally graded solids by the MLPG. CMES – Computer Modeling in Engineering & Sciences 43(3), 223–251 (2009)
Sladek, J., Sladek, V., Solek, P., Saez, A.: Dynamic 3D axisymmetric problems in continuously nonhomogeneous piezoelectric solids. Int. J. Sol. Struct. 45, 4523–4542 (2008)
Sladek, J., Sladek, V., Stanak, P., Zhang, C., Wunsche, M.: Analysis of the bending of circular piezoelectric plates with functionally graded material properties by a MLPG method. Engineering Structures 47, 81–89 (2012)
Stanak, P., Sladek, J., Sladek, V., Krahulec, S.: Bending of functionally graded circular plates wih piezoelectric layer by the MLPG method. In: Proc. Engineering Mechanics 2012, CD-rom (2012)
Lancaster, P., Salkauskas, T.: Surfaces generated by moving least-square methods. Math. Comput. 37, 141–158 (1981)
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Stanak, P., Sladek, J., Sladek, V., Tadeu, A. (2014). Three-Dimensional Meshless Modelling of Functionally Graded Piezoelectric Sensor. In: Březina, T., Jabloński, R. (eds) Mechatronics 2013. Springer, Cham. https://doi.org/10.1007/978-3-319-02294-9_54
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DOI: https://doi.org/10.1007/978-3-319-02294-9_54
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