Abstract
Electronic components used in electronic gadgets are becoming increasingly thin, tiny, and miniature. The assembly of miniaturized components requires an enhanced joining technique and reliable soldering material for the tiny solder junction. However, sophisticated assembly procedures for tiny components using nano-reinforced solder paste on real surface mount devices continue to be a significant research gap. Thus, the purpose of this work is to evaluate the advanced joining of ultra-fine packages utilizing nano-reinforced solder paste following reflow soldering. TiO2, Fe2O3, and NiO nanoparticles (with 0.01 wt.%, 0.05 wt.%, and 0.15 wt.%) were chosen to reinforce lead-free solder paste (SAC 305 type 5) to create three samples with varying nanoparticle types. The samples were then assembled using a reflow soldering process. The performance nano-reinforced solder paste was compared to a pure SAC305 solder paste in terms of material and mechanical properties. Various experimental techniques were used to characterize the microstructure, fillet height, and hardness. The experimental results show that the presence of nanoparticles improves the material and structural integrity of the ultra-fine solder joint in general. By adding 0.15 wt percent TiO2, Fe2O3, and NiO, the average hardness of SAC305 increased by 77%, 86%, and 67%, respectively. It also improves the fillet height above 90 µm for TiO2, Fe2O3, and NiO, which meet the international IPC standards for reliability. This research gives engineers a detail insight on the performance of the nano-reinforced solder joint for a miniaturized package in the microelectronics industry. The findings are expected to provide a proper guideline and reference for the manufacture of miniaturized electronic packages. The findings are expected to serve as an appropriate reference and guidance for the manufacturing of compact electronic packages.
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Acknowledgements
The authors would like to thank the Universiti Sains Malaysia through Research University Grant (1001.PMEKANIK.8014607), Universiti Kebangsaan Malaysia (Research grant–DIP-2014-012) and Jabil Circuit Sdn Bhd for their financial support. The authors wish to extend their appreciation to Prof. Ir. Dr. M.Z. Abdullah, Mr. Z. Samsudin and Mr. M.Y. Tura Ali for their technical support.
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Ani, F.C., Saad, A.A., Jalar, A., Khor, C.Y., Abas, M.A., Bachok, Z. (2022). Advanced Assembly of Miniaturized Surface Mount Technology Components Using Nano-reinforced Solder Paste. In: Salleh, M.A.A.M., Abdul Aziz, M.S., Jalar, A., Izwan Ramli, M.I. (eds) Recent Progress in Lead-Free Solder Technology. Topics in Mining, Metallurgy and Materials Engineering. Springer, Cham. https://doi.org/10.1007/978-3-030-93441-5_6
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DOI: https://doi.org/10.1007/978-3-030-93441-5_6
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