Sn-whiskers: truths and myths

  • Chapter
  • First Online:
Lead-Free Electronic Solders

Abstract

Whisker growth from the solid state has been documented in the public domain for more than 60 years. Unfortunately, a basic understanding upon which a quantitative model, one which would provide a means for predicting whisker growth and risk and ultimate prevention strategies, remains elusive. This paper is an attempt to critically review (hopefully with minimal bias) the state of Sn-whisker growth and mitigation. This is done by: (i) examining the existing experimental data and the limitations of collecting such data, (ii) analyzing the proposed driving forces, mechanism and models for whisker growth, and (iii) carefully evaluating the proposed mitigation strategies and how subsequent assembly processes and device applications may or may not impact these strategies. In each area, the validity of the model and mitigation strategy is examined by comparing it to existing experimental data. Areas where the experimental data is insufficient to adequately test the theory or predict risk are identified. In addition, the areas where experimental difficulties are found that could potentially negatively impact data collection and analysis are reviewed. The authors hope that at a minimum this review will provide a starting point for discussion between the users of the final products, the producers of the final products and the electronic components used in the final products on the topic of Sn-whisker growth, and its mitigation and risk management. In the best case scenario it could provide directions for the advancement of both experimental work and theoretical understanding of Sn-whisker growth and mitigation.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Subscribe and save

Springer+ Basic
EUR 32.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or Ebook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Chapter
EUR 29.95
Price includes VAT (France)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
EUR 160.49
Price includes VAT (France)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
EUR 210.99
Price includes VAT (France)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free ship** worldwide - see info
Hardcover Book
EUR 210.99
Price includes VAT (France)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free ship** worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Similar content being viewed by others

References

  1. M. Warwick, J. SMT 12, 1 (1999)

    Google Scholar 

  2. Y. Zang, Circuit Tree 94 (2001)

    Google Scholar 

  3. V.K. Glaxunova, N.T. Nudryavstev, J. Appl. Chem. USSR 36, 519 (1963)

    Google Scholar 

  4. P.L. Key, in Proc. Electronics Components Conference (1970), p. 155

    Google Scholar 

  5. S.C. Britton, Trans IMF 52, 95 (1974)

    Google Scholar 

  6. B.D. Dunn, ESA Sci. Tech. Rev. 2, 1 (1976)

    Google Scholar 

  7. R.F. Dielh, N.A. Cifaldi, in Proc. 8th Annual Connector Symposium (1975), p. 328

    Google Scholar 

  8. S.M. Arnold, Plating PLATA 53, 96 (1966)

    Google Scholar 

  9. G.T.T. Sheng, C.F. Hu, W.J. Choi, K.N. Tu, Y.Y. Bong, L. Nguyen, J. Appl. Phys. 92, 64 (2002)

    Article  Google Scholar 

  10. W.J. Choi, T.Y. Lee, K.N. Tu, N. Tamura, R.S. Celestre, A.A. MacDowell, Y.Y. Bong, L. Nguyen, G.T.T. Sheng, in Proc. 53rd Electronic Components and Technology Conference (2002), p. 628

    Google Scholar 

  11. B.Z. Lee, D.N. Lee, Acta Mater. 49, 3701 (1998)

    Article  Google Scholar 

  12. K.N. Tu, Phys. Rev. B 49, 2030 (1994)

    Article  Google Scholar 

  13. Tin Whisker Formation in Electronic Circuits, Aerospace Report No. TR-92, Dec. 1 (1992)

    Google Scholar 

  14. T. Kakeshita, R. Kawanaka, T. Hasegawa, J. Mater. Sci. 17, 2560 (1982)

    Article  Google Scholar 

  15. Y. Zhang, J.A. Abys, Circuit World 25, 30 (1998)

    Article  Google Scholar 

  16. JEDEC22-A121

    Google Scholar 

  17. JEDEC-201

    Google Scholar 

  18. H. Leidecker, J. Brusse, Tin Whiskers: A History of Documented Electrical System Failures. Briefing for NASA Space Shuttle Program, April 2006 (personal communication)

    Google Scholar 

  19. G.T. Galyon, IEEE Trans. Electron. Packag. Manufact. 28, 94 (2005)

    Article  Google Scholar 

  20. J.W. Osenbach, J.M. DeLucca, B.D. Potteiger, A. Amin, R.L. Shook, F.A. Baiocchi, Presented at ECTC Sn-Whisker workshop, June, 2005, accepted for publication in IEEE Trans. Electron. Packag. Manufact

    Google Scholar 

  21. J.W. Osenbach, R.L. Shook, B.T. Vaccaro, B.D. Potteiger, A.N. Amin, K.N. Hooghan, S. Suratkar, P. Ruengsinsub, IEEE Trans. Electron. Packag. Manufact. 28, 36 (2005)

    Article  Google Scholar 

  22. N.A.J. Sabbagh, H.J. McQueen, Metal Finishing, March, 21(1975)

    Google Scholar 

  23. S.M. Arnold, Plating PLATA 53, 96 (1966)

    Google Scholar 

  24. M.W. Barsoum, E.N. Hoffman, R.D. Doherty, S. Gupta, A. Zavalianos, Phys. Rev. Lett. 93, 206104-1 (2005)

    Google Scholar 

  25. P. Oberndorff, M. Dittes, P. Crema, S. Chopin, in Proc. of the 55th Electronic Components and Technology Conference (2005), pp. 429–433

    Google Scholar 

  26. P. Su, M. Ding, S. Chopin, in Proc. of the 55th Electronic Components and Technology Conference (2005), pp. 434–440

    Google Scholar 

  27. See for example, J.W. Osenbach, Semicond. Sci. Technol. 11, 155 (1996)

    Google Scholar 

  28. D.W. Rice, P.B.P. Phipps, J. Electrochem. Soc. 127, 563(1980)

    Article  Google Scholar 

  29. D.W. Rice, R.J. Cappell, W. Kinsolving, J.J. Laskowski, J. Electrochem. Soc. 127, 891 (1980)

    Article  Google Scholar 

  30. J.D. Sinclair, L.A. Psota-Kelly, C.J. Weschler, Atmos. Environ. 19, 315 (1985)

    Article  Google Scholar 

  31. W.C. Ellis, D.F. Gibbon, R.G. Treuting, in Growth and Perfection of Crystals, ed. by R.H. Doremuss, B.W. Roberts, D. Turnbull (John Wiley and Sons, New York, 1958), pp. 102–120

    Google Scholar 

  32. W.C. Ellis, Trans. Met. Soc. AIME 236, 872 (1966)

    Google Scholar 

  33. J.D. Eshelby, J. Appl. Phys. 91, 755 (1953)

    Google Scholar 

  34. F.C. Frank, Phil. Mag. 44, 854 (1953)

    Google Scholar 

  35. N. Furuta, K. Hamamura, J. Appl. Phys. 8, 1404 (1969)

    Article  Google Scholar 

  36. I. Boguslavsky, P. Bush, in APEX Conf., 2003

    Google Scholar 

  37. R.M. Fisher, L.S. Darken, K.G. Carrol, Acta Metall. 2, 368 (1954)

    Article  Google Scholar 

  38. U. Lindborg, Met. Trans. 6A, 1581 (1975)

    Google Scholar 

  39. B.Z. Lee, D.N. Lee, Acta Mater. 49, 3701 (1998)

    Article  Google Scholar 

  40. J. Liang, X. Li, Z. Xu, D. Shangguan, in IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, CA, 18–20 April 2005

    Google Scholar 

  41. C.H. Pitt, R.G. Henning, J. Appl. Phys. 35, 460 (1964)

    Article  Google Scholar 

  42. Y. Zhang, C. Fan, C. Xu, O. Khaselev, J.A. Abys, in Proc. IPC SMEMA APEX Conf. (2002)

    Google Scholar 

  43. C.Y. Chang, R.W. Vook, Thin Solid Films 288, 205 (1993)

    Article  Google Scholar 

  44. W.J. Boettinger, C.E. Johnson, L.A. Bendersky, K.-W. Moon, M.E. Williams, G.R. Stafford, Acta Mater. 53, 5033 (2005)

    Article  Google Scholar 

  45. H.P. Kehrer, H.G. Kadereit, Appl. Phys. Lett. 16, 411 (1970)

    Article  Google Scholar 

  46. G.T. Galyon, L. Palmer, IEEE Trans. Electron. Packag. Manufact. 28, 17 (2005)

    Article  Google Scholar 

  47. J.A. Rayne, B.S. Chandrasekhar, Phys. Rev. 120, 1658 (1960)

    Article  Google Scholar 

  48. M. Rozen, Plating 55, 1155 (1968)

    Google Scholar 

  49. Y. Zhang, C. Xu, C. Fan, J. Abys, J. Surf. Mount Tech. 13, 1 (200)

    Google Scholar 

  50. R.D. Hilty, iNEMI meeting at Herndon VA, (2005) (communication)

    Google Scholar 

  51. K.W. Moon, M.E. Williams, C.W. Johnson, G.R. Stafford, C.A. Hanweker, M.J. Boettinger, in Proc. Pacific Rim Inter. Conf. Advanced Materials and Processing (2001), pp. 1115–1118

    Google Scholar 

  52. R. Schetty, N. Brown, A. Egli, J. Heber, A. Vinckler, in Proc. AESF SUR/FIN Conf. (2001), pp. 1–5

    Google Scholar 

  53. V.K. Glazunova, Kristallografiya 7, 761 (1962)

    Google Scholar 

  54. V.K. Glazunova, N.T. Kudryavtsev, Zh. Prikladnoi Khim. 36, 543 (1963)

    Google Scholar 

  55. M. Ishii, T. Kataoka, H. Kruihara, in Proc. 12th Eur. Microelectronics and Packaging Conference (1999), pp. 379–385

    Google Scholar 

  56. M. Ditte, P. Oberndorff, L. Petit, in Proc. 53rd Electronic Components and Technology Conference (2003), pp. 822–830

    Google Scholar 

  57. K.N. Tu, R.D. Thompson, Acta Met. 30, 947 (1982)

    Article  Google Scholar 

  58. A. Paul, A.A. Kodentsov, F.J.J. van Loo, Z. Metallkd. 95, 913 (2004)

    Google Scholar 

  59. M. Oh, Ph. D. Thesis, Lehigh Univ. (1994) p. 60, 99

    Google Scholar 

  60. M. Onishi, H. Fujibuchi, JIM 16, 539 (1975)

    Google Scholar 

  61. H.C. Bhedwar, K.K. Ray, S.D. Kulkarni, V. Balasubramanian Script Metall. 6, 919 (1972)

    Article  Google Scholar 

  62. L.C. Correa da Silva, R.F. Mehl, Trans. AIME 191, 155 (1951)

    Google Scholar 

  63. H. Oikawa, A. Hosoi, Scripta Metall. 9, 823 (1975)

    Article  Google Scholar 

  64. S.-J. Kim, K.-S. Bae, in Proc. Electronic Packaging Conference (2000), pp. 81–85

    Google Scholar 

  65. K. Cunningham, M. Donahue, in Proc. 4th International SAMPE Electronics Conf. (1990)

    Google Scholar 

  66. G. Henshall, Presented at the 3rd annual ECTC Sn-whisker workshop, 2006

    Google Scholar 

  67. H. Renolds, Presented at the 3rd annual ECTC Sn-whisker workshop, 2006

    Google Scholar 

  68. W.G. Bader, Welding J. Res. Supl. 48, 551 (1969)

    Google Scholar 

  69. See for example, M. Hansen, K. Anderko (eds.), Constitution of Binary Alloys, 2nd edn. (McGraw-Hill, New York, 1958), pp. 633–637

    Google Scholar 

  70. See for example, M. Hansen, K. Anderko (eds.), Constitution of Binary Alloys, 2nd edn. (McGraw-Hill, New York, 1958), pp. 1041–1047

    Google Scholar 

  71. K.N. Tu, Mater. Chem. Phys. 42, 217 (1996)

    Article  Google Scholar 

  72. D. Unsworth, in Modern Solder Technology for Competitive Electronic Manufacturing, ed. by J. Hwang (McGraw Hill, New York, 1996), pp. 397–400

    Google Scholar 

  73. A.C.K. So, Y.C. Chan, J.K.L. Lai, IEEE Comp. Pkg. Manuf. Technol, part B, 20 (1997)

    Google Scholar 

  74. M. Onishi, H. Fujibuchi, Trans. JIM 16, 539 (1999)

    Google Scholar 

  75. E. Starke, H. Wever, Z. Merallk 155, 108 (1964)

    Google Scholar 

  76. J. Haimovich data, in NEMI user group web site. http://www.nemi.org

    Google Scholar 

  77. J. W. Osenbach, in NEMI user group web site. http://www.nemi.org

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

Copyright information

© 2006 Springer Science+Business Media, LLC

About this chapter

Cite this chapter

Osenbach, J.W., DeLucca, J.M., Potteiger, B.D., Amin, A., Baiocchi, F.A. (2006). Sn-whiskers: truths and myths. In: Lead-Free Electronic Solders. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-48433-4_19

Download citation

  • DOI: https://doi.org/10.1007/978-0-387-48433-4_19

  • Published:

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-387-48431-0

  • Online ISBN: 978-0-387-48433-4

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics

Navigation