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Ultra Thin No/N20 Oxynitride Dielectric for Advanced Flash Memory Application: Single Wafer and Batch Technology

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Abstract

In this paper a systematic investigation of nitrided oxides obtained by Rapid Thermal Oxidation/Nitridation (RTO/RTN) in AMAT Centura System is reported. Two different aspects were considered: first the comparison between single wafers and batch technology, second the different possible oxide architecture achievable with RTO/RTN system (i.e. RTO + RTN, RTN + RTO, RTN + RTO + RTN). Both morphological and patterned wafers were processed. Physical and chemical characterizations were carried out by means of SIMS, XPS, ELYMAT, AFM and Etching Rate studies. Morphological results were then correlated to electrical data obtained on MOS capacitors. The film obtained performing a NO RTN nitridation of the native oxide followed by a ISSG (In Situ Steam Generation) oxidation exhibited very promising electrical properties that made it an appealing candidate as gate dielectric in CMOS and Flash memories applications.

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References

  1. M. Bhat, L.K. Han, D. Wristers, J. Yan, D.L. Kwong, J. Fulford, Appl. Phys. Lett., 66, p.1225 (1995).

    Article  CAS  Google Scholar 

  2. M. Bhat, G. W. Yoon, J. Kim, D.L. Kwong, M. Arendt, J.M. White, AppL. Phys. Lett., 64, p.2116 (1994).

    Article  CAS  Google Scholar 

  3. G. Roters, W. Lerch, Z. Nenyei, A. Huber, G. Obermeier, Proceedings of the 7th Int. Conf RTP99, Colorado Springs, CO (1999), p.106–112.

  4. C. Gerardi, R. Zonca, B. Crivelli, M. Alessandri, J. of Electrochem. Soc., 146, p.3058–3064 (1999).

    Article  CAS  Google Scholar 

  5. A.P. Caricato, F. Cazzaniga, C.F. Cerofolini, B. Crivelli, M.L. Polignano, G. Tallarida, S. Valeri, R. Zonca, Ultrathin SiO2 and High-K Materials for ULSI Gate Dielectrics, edited by H.R. Huff, C.A. Richter, M.L. Green, G. Lucovsky, T. Hattori (Mater.Res.Soc.Proc. 567, San Francisco, CA, 1999) p.135–140.

  6. E.C. Carr, K.A. Ellis, R.A. Buhrman, Appl. Phys. Lett., 66, p.1492–1494 (1995).

    Article  CAS  Google Scholar 

  7. M.L. Polignano, M. Alessandri, D. Brazzelli, B. Crivelli, G. Ghidini, R. Zonca, MRS99 to be presented.

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Acknowledgments

The authors would like to express sincere thanks to G. Ghidini and E. Bellandi for the useful and critical discussions.

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Correspondence to R. Zonca.

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Zonca, R., Crivelli, B., Polignano, M.L. et al. Ultra Thin No/N20 Oxynitride Dielectric for Advanced Flash Memory Application: Single Wafer and Batch Technology. MRS Online Proceedings Library 592, 161–166 (1999). https://doi.org/10.1557/PROC-592-141

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  • DOI: https://doi.org/10.1557/PROC-592-141

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