Abstract
Excimer laser ablation is applied in the deflashing and demarking of IC packages. It is found that mold flash filled in the interface holes of IC leadframe can be removed completely by the laser deflashing in a short period of time. With appropriate selection of laser parameters, deflashing quality and efficiency can be greatly improved. The laser deflashing is more efficient for higher pin count packages. It is a superior alternative in future applications. In laser demarking, ink marks on package surfaces can also be removed completely in a short time. The surface after the processing has good conditions for remarking. The package remarking shows good permanency. The lifetime for good marking is much longer for IC packages after the laser demarking than those after hydrogen flame-off. Laser processing can be used to replace hydrogen flame-off in the ink printing of IC packages for high efficiency and safety.
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References
L.T. Manzione, AT&T Plastic Packaging of Microelectronic Devices, Van Nostrand Reinhold, New York, 1990, p. 171.
P.H. Singer, Semiconductor International, 8 (June 1985), p. 67.
R.F. Zecber, Plastics Engineering, 8 (June 1985), p. 35.
Y.F. Lu, D.S.H. Chan and T. S. Low, Pulse Laser Removal of Mold Flash on Integrated Circuit Packages. Patent being filed.
R. Iscoff, Semiconductor International, 8 (Dec. 1985), p. 38.
A. Seth and J. Scaroni, Semiconductor International, 9 (Oct. 1986), p. 80.
H. W. Bergmann, K. Schutte, E. Schubert and A. Emmel, Applied Surface Science, 86 (1995), p. 259.
K. Schutte and H.W. Bergmann, Excimer Lasers. Kluwer Academic Publishers, London, 1993, P. 355.
Mil-std 883C, work method 2015, Feb. 1988.
J.H. Linn, M.M. Higley, C.A. Arruda, M.E. Walter and S. Kosto, Semiconductor International, 18 (Apr. 1995), p. 79.
M.C. Gower, Laser Processing in Manufacturing, Chapman & Hall, London, 1993, p. 189.
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Lu, Y.F., Hong, M.H., Chan, D.S.H. et al. Excimer Laser Applications in Integrated Circuit Packaging. MRS Online Proceedings Library 397, 323–328 (1995). https://doi.org/10.1557/PROC-397-323
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DOI: https://doi.org/10.1557/PROC-397-323