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Adhesion Strength of Cu/Polyimide Interfaces by Micro-Wedge Scratching

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Abstract

The micro-wedge scratch technique was applied to characterize interfacial properties of copper fine lines on PMDA-ODA polyimide. A 20 urn wide, 0.1 g⩖ radius wedge-shaped diamond tip was used to mechanically debond Cu fine lines from polyimide substrate. Copper fine lines varies from 0.2 to 0.4 urn thick, and from 1 urn to 100 fim wide. Both cohesive and adhesive delaminations were obtained. Load-displacement curves were recorded and the scratch morphologies were observed by SEM. From a first order calculation, the fracture toughness of the polyimide and interfacial strength of Cu-PI were obtained.

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Authors and Affiliations

  1. Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN, 55455, USA

    F. Wang, J. C. Nelson, H. Huang & W. W. Gerberich

  2. Sheldahl Inc. Northfield, MN, 55057, USA

    R. L. Swisher

Authors
  1. F. Wang
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  2. J. C. Nelson
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  3. H. Huang
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  4. R. L. Swisher
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  5. W. W. Gerberich
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Wang, F., Nelson, J.C., Huang, H. et al. Adhesion Strength of Cu/Polyimide Interfaces by Micro-Wedge Scratching. MRS Online Proceedings Library 338, 571–576 (1994). https://doi.org/10.1557/PROC-338-571

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  • DOI: https://doi.org/10.1557/PROC-338-571

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