Abstract
Silicon oxide based and aluminum gated MOS structures fabricated on n-type silicon are investigated after irradiation with low energy electrons in scanning electron microscope. The thermally stimulated current (TSC) technique in the temperature range from 80 K to 320 K revealed a number of the electron beam induced charge traps. With the help of the capacitance-voltage method, the traps revealed by the TSC were identified by their location (within dielectric, semiconductor or at the interface) and by their nature (trap for electrons or for holes).
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1134%2FS1063739723600516/MediaObjects/11180_2024_7514_Fig1_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1134%2FS1063739723600516/MediaObjects/11180_2024_7514_Fig2_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1134%2FS1063739723600516/MediaObjects/11180_2024_7514_Fig3_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1134%2FS1063739723600516/MediaObjects/11180_2024_7514_Fig4_HTML.png)
REFERENCES
Raghavan, N., Pey, K.L., and Shubhakar, K., High-k dielectric breakdown in nanoscale logic devices- Scientific insight and technology impact, Microelectron. Reliab., 2014, vol. 54, no. 5, pp. 847–860. https://doi.org/10.1016/j.microrel.2014.02.013
Nawaz, M., On the evaluation of gate dielectrics for 4H-SiC based power MOSFETs, Act. Passive Electron. Compon., 2015, vol. 2015, p. 651527. https://doi.org/10.1155/2015/651527
Ao, J., Nakatani, K., Sogawa, Y., Akamatsu, S., Kim, Y.H., Miyashita, T., Motoyama, S., and Ohno, Y., GaN MOSFET with a gate SiO2 insulator deposited by silane-based plasma-enhanced chemical vapor deposition, Phys. Status Solidi (c), 2011, vol. 8, no. 2, pp. 457–460. https://doi.org/10.1002/pssc.201000489
Nicollian, E.H., Surface passivation of semiconductors, J. Vac. Sci. Technol., 1971, vol. 8, no. 5, pp. S39–S49. https://doi.org/10.1116/1.1316388
Glunz, S.W. and Feldmann, F., SiO2 surface passivation layers—A key technology for silicon solar cells, Sol. Energy Mater. Sol. Cells, 2018, vol. 185, pp. 260–269. https://doi.org/10.1016/j.solmat.2018.04.029
Kim, T., Park, T., and Lim, S., Improvement of Si3N4/SiO2 etching selectivity through the passivation of SiO2 surface in aromatic carboxylic acid-added H3P-O4 solutions for the 3D NAND integration, Appl. Surf. Sci., 2023, vol. 619, p. 156758. https://doi.org/10.1016/j.apsusc.2023.156758
Mehonic, A., Cueff, S., Wojdak, M., Hudziak, S., Jambois, O., Labbe, C., Garrido, B., Rizk, R., and Kenyon, A.J., Resistive switching in silicon suboxide films, J. Appl. Phys., 2012, vol. 111, no. 7, p. 74507. https://doi.org/10.1063/1.3701581
Dubonos, S.V., Gaifullin, B.N., Raith, H.F., Svintsov, A.A., and Zaitsev, S.I., Evaluation, verification and error determination of proximity parameters α, β and ν in electron beam lithography, Microelectron. Eng., 1993, vol. 21, nos. 1–4, pp. 293–296. https://doi.org/10.1016/0167-9317(93)90076-H
Koveshnikov, S., Knyazev, M., and Soltanovich, O., Generation, relaxation and annealing of Si/SiO2 charges induced by low-energy electron beam, J. Mater. Sci. Eng. B, 2021, vol. 274, p. 115487. https://doi.org/10.1016/j.mseb.2021.115487
Chen, X.J., Barnaby, H.J., Schrimpf, R.D., Fleetwood, D.M., Pease, R.L., Platteter, D.G., and Dunham, G.W., Nature of interface defect buildup in gated bipolar devices under low dose rate irradiation, IEEE Trans. Nucl. Sci., 2006, vol. 53, no. 6, pp. 3649–3654. https://doi.org/10.1109/TNS.2006.885375
Hakata, T., Ohyama, H., Simoen, E., Claeys, C., Miyahara, K., Kawamura, K., Ogita, Y., and Takami, Y., Degradation of MOSFETs on SIMOX by irradiation, J. Radioanal. Nucl. Chem., 1999, vol. 239, no. 2, pp. 357–360. https://doi.org/10.1007/BF02349511
Blood, P. and Orton, J.W., The Electrical Characterization of Semiconductors: Majority Carriers and Electron States, London: Academic, 1992.
Bernstein, G.H., Polchorek, S.W., Kamath, R., and Porod, W., Determination of fixed electron-beam-induced positive oxide charge, Scanning, 1992, vol. 14, no. 6, pp. 345–349. https://doi.org/10.1002/sca.4950140606
Ravindra, N.M. and Zhao, J., Fowler–Nordheim tunneling in thin SiO2 films, Smart Mater. Struct., 1999, vol. 1, no. 3, pp. 197–201. https://doi.org/10.1088/0964-1726/1/3/002
Lang, D.V., Deep level transient spectroscopy: A new method to characterize traps in semiconductors, J. Ap-pl. Phys., 1974, vol. 45, no. 7, pp. 3023–3032. https://doi.org/10.1063/1.1663719
Funding
The presented study is performed within the state task of IMT RAS no. 075-01304-23-00.
Author information
Authors and Affiliations
Corresponding authors
Ethics declarations
The authors of this work declare that they have no conflicts of interest.
Additional information
Publisher’s Note.
Pleiades Publishing remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Aliasgari Renani, R., Soltanovich, O.A., Knyazev, M.A. et al. Investigation of Low Energy Electron Irradiated SiO2 Based MOS Devices by Capacitance-Voltage and Thermally Stimulated Current Techniques. Russ Microelectron 52 (Suppl 1), S274–S278 (2023). https://doi.org/10.1134/S1063739723600516
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1063739723600516