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Assembly of 3D-wares with the use of wire leadouts

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Abstract

Some methods of the formation of microwelds, which are most acceptable for the assembly of 3D-wares with the use of wire leadouts, have been analyzed. Some peculiarities of the bonding of inner wirings on a die and a package by different welding methods, such as pressure welding with indirect pulsed heating and thermosonic, ultrasonic, and split-tip welding, have been considered. The effect of structural and technological factors on the quality of microwelds made by ultrasonic welding with the use of aluminum wire, aluminum metallization on a die, and gold, nickel, and nickel alloy coatings has been studied. Some information on microwelds made with the use of copper wire and copper metallization has been represented.

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Authors and Affiliations

  1. Voronezh State Technical University, Moskovskii pr. 14, Voronezh, 394026, Russia

    V. V. Zenin

  2. Research Institute of Electronics, ul. Starykh Bol’shevikov 5, Voronezh, 394033, Russia

    A. A. Stoyanov

  3. OAO Voronezh Plant of Semiconductor Devices-Assembly, Leninskii pr. 119a, Voronezh, 394033, Russia

    S. V. Petrov & S. Yu. Chistyakov

Authors
  1. V. V. Zenin
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  2. A. A. Stoyanov
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  3. S. V. Petrov
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  4. S. Yu. Chistyakov
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Correspondence to V. V. Zenin.

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Original Russian Text © V.V. Zenin, A.A. Stoyanov, S.V. Petrov, S.Yu. Chistyakov, 2014, published in Mikroelektronika, 2014, Vol. 43, No. 1, pp. 29–42.

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Zenin, V.V., Stoyanov, A.A., Petrov, S.V. et al. Assembly of 3D-wares with the use of wire leadouts. Russ Microelectron 43, 21–33 (2014). https://doi.org/10.1134/S1063739714010090

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