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Thermal conductivity of suspension containing SiC particles

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Journal of Materials Science Letters

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Authors and Affiliations

  1. Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, 200050, People's Republic of China

    Huaqing **e, **chang Wang, Tonggeng **, Yan Liu & Fei Ai

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  1. Huaqing **e
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  2. **chang Wang
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  3. Tonggeng **
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  4. Yan Liu
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  5. Fei Ai
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Correspondence to Huaqing **e.

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**e, H., Wang, J., **, T. et al. Thermal conductivity of suspension containing SiC particles. Journal of Materials Science Letters 21, 193–195 (2002). https://doi.org/10.1023/A:1014742722343

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