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Investigation on the Solidification and Phase Transformation in Pb-Free Solders Using In Situ Synchrotron Radiography and Diffraction: A Review

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Acta Metallurgica Sinica (English Letters) Aims and scope

Abstract

It is widely accepted that further development of Pb-free solder alloys for improved processing and in-service properties of next-generation electronics, can be accelerated through a fundamental understanding of phase transformation and microstructure control in Pb-free solder joints. Advanced characterization techniques including synchrotron radiation provide a comprehensive toolset to measure the composition, crystallography, morphology, and properties of the major components of solder alloys. The research using such techniques is reviewed in detail including the characterization of the effects of micro-alloy additions on the microstructure and properties of Pb-free solder joints, especially those on the intermetallic phases. The discoveries outlined are of scientific and industrial relevance and have implications for new solder alloy composition design and the reliability of lead-free solder joints.

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References

  1. C.M. Gourlay, K. Nogita, A.K. Dahle, Y. Yamamoto, K. Uesugi, T. Nagira, M. Yoshiya, H. Yasuda, Acta Mater. 59, 4043 (2011)

    Article  CAS  Google Scholar 

  2. G. Zeng, S.D. McDonald, Q. Gu, Y. Terada, K. Uesugi, H. Yasuda, K. Nogita, Acta Mater. 83, 357 (2015)

    Article  CAS  Google Scholar 

  3. G. Zeng, S.D. McDonald, D. Mu, Y. Terada, H. Yasuda, Q. Gu, K. Nogita, Intermetallics 54, 20 (2014)

    Article  CAS  Google Scholar 

  4. G. Zeng, Phase Formation, Transformation and Stability in Micro-Alloyed Sn-Based Lead-Free Solder Alloys and Joints (The University of Queensland, Australia, 2014)

    Book  Google Scholar 

  5. M.A.A.M. Salleh, S.D. McDonald, H. Yasuda, A. Sugiyama, K. Nogita, Scr. Mater. 100, 17 (2015)

    Article  Google Scholar 

  6. M.A. Salleh, C.M. Gourlay, J.W. **an, S.A. Belyakov, H. Yasuda, S.D. McDonald, K. Nogita, Sci. Rep 7, 40010 (2017)

    Article  Google Scholar 

  7. X.F. Tan, S.D. McDonald, Q.F. Gu, L.Z. Wang, S. Matsumura, K. Nogita, J. Power Sources 440, 227085 (2019)

    Article  CAS  Google Scholar 

  8. G. Zeng, M.D. Callaghan, S.D. McDonald, H. Yasuda, K. Nogita, J. Alloys Compd. 797, 804 (2019)

    Article  CAS  Google Scholar 

  9. G. Zeng, S.D. McDonald, C.M. Gourlay, K. Uesugi, Y. Terada, H. Yasuda, K. Nogita, Metall. Mater. Trans. A 45, 918 (2014)

    Article  CAS  Google Scholar 

  10. T.M. Wang, J. Zhu, H.J. Kang, Z.N. Chen, Y.N. Fu, W.X. Huang, T.Q. **ao, Appl. Phys. A 117, 1059 (2014)

    Article  CAS  Google Scholar 

  11. M.L. Huang, Z.J. Zhang, N. Zhao, Q. Zhou, Scr. Mater. 68, 853 (2013)

    Article  CAS  Google Scholar 

  12. J. Zhu, T.M. Wang, F. Cao, W.X. Huang, H.W. Fu, Z.N. Chen, Mater. Lett. 89, 137 (2012)

    Article  CAS  Google Scholar 

  13. D. Tolnai, P. Townsend, G. Requena, L. Salvo, J. Lendvai, H.P. Degischer, Acta Mater. 60, 2568 (2012)

    Article  CAS  Google Scholar 

  14. H.T. Ma, L. Qu, M.L. Huang, L.Y. Gu, N. Zhao, L. Wang, J. Alloys Compd. 537, 286 (2012)

    Article  CAS  Google Scholar 

  15. A. Bogno, H. Nguyen-Thi, A. Buffet, G. Reinhart, B. Billia, N. Mangelinck-Noel, N. Bergeon, J. Baruchel, T. Schenk, Acta Mater. 59, 4356 (2011)

    Article  CAS  Google Scholar 

  16. K. Nogita, H. Yasuda, C.M. Gourlay, S. Suenaga, H. Tsukamoto, S.D. Mcdonald, A. Takeuchi, K. Uesugi, Y. Suzuki, J. Jpn. Inst. Electron. Packag. 3, 40 (2010)

    CAS  Google Scholar 

  17. A. Bogno, H. Nguyen-Thi, N. Bergeon, N. Mangelinck-Noël, T. Schenk, B. Billia, E. Boller, J. Baruchel, Nucl. Instrum. Methods. Phys. Res. B 268, 394 (2010)

    Article  CAS  Google Scholar 

  18. K.S. Wallwork, B.J. Kennedy, D. Wang, J. Synchrotron Radiat. 879, 879 (2007)

    Article  CAS  Google Scholar 

  19. B. Li, H.D. Brody, A. Kazimirov, Metall. Mater. Trans. A 38, 599 (2007)

    Article  Google Scholar 

  20. J. Suh, K. Tu, N. Tamura, JOM 58, 63 (2006)

    Article  CAS  Google Scholar 

  21. T. Schenk, H.N. Thi, J. Gastaldi, G. Reinhart, V. Cristiglio, N. Mangelinck-Noel, H. Klein, J. Hartwig, B. Grushko, B. Billia, J. Baruchel, J. Cryst. Growth 275, 201 (2005)

    Article  CAS  Google Scholar 

  22. Z.Y. Ding, N.F. Zhang, L. Yu, W.Q. Lu, J.G. Li, Q.D. Hu, Acta Metall. Sin.-Engl. Lett. 34, 145 (2021)

    Article  CAS  Google Scholar 

  23. S.K. Feng, E. Liotti, M.D. Wilson, L. Jowitt, P.S. Grant, MRS Bull. 45, 934 (2020)

    Article  Google Scholar 

  24. J.W. Gibbs, D. Tourret, P.J. Gibbs, S.D. Imhoff, M.J. Gibbs, B.A. Walker, K. Fezzaa, A.J. Clarke, JOM 68, 170 (2016)

    Article  CAS  Google Scholar 

  25. S. Karagadde, C.L.A. Leung, P.D. Lee, Materials 14, 2374 (2021)

    Article  CAS  Google Scholar 

  26. B. Kim, S. Lee, S. Lee, H. Yasuda, Mater. Trans. 53, 374 (2012)

    Article  CAS  Google Scholar 

  27. F.G. Li, J. Zhang, Y.B. Dai, F.G. Bian, Y.A. Fu, F.C. Yin, B.D. Sun, J. Cryst. Growth 428, 1 (2015)

    Article  CAS  Google Scholar 

  28. E. Liotti, C. Arteta, A. Zisserman, A. Lui, V. Lempitsky, P.S. Grant, Sci. Adv. 4, 4004 (2018)

    Article  Google Scholar 

  29. E. Liotti, A. Lui, R. Vincent, S. Kumar, Z. Guo, T. Connolley, I.P. Dolbnya, M. Hart, L. Arnberg, R.H. Mathiesen, P.S. Grant, Acta Mater. 70, 228 (2014)

    Article  CAS  Google Scholar 

  30. T. Nagira, N. Nakatsuka, H. Yasuda, K. Uesugi, A. Takeuchi, J. Iron Steel Inst. Jpn. 102, 66 (2016)

    Article  Google Scholar 

  31. T. Narumi, T. Nakata, R. Kobayashi, H. Yasuda, ISIJ Int. 61, 1567 (2021)

    Article  CAS  Google Scholar 

  32. T. Narumi, T. Nakata, H. Yasuda, Iop, Observation of semisolid deformation by using 4D-CT and 3DXRD. In International Conference on Modelling of Casting, Welding and Advanced Solidification Processes (2020)

  33. F. Wang, D. Eskin, J.W. Mi, C.N. Wang, B. Koe, A. King, C. Reinhard, T. Connolley, Acta Mater. 141, 142 (2017)

    Article  CAS  Google Scholar 

  34. Y.B. Wang, S.S. Jia, M.G. Wei, L.M. Peng, Y.J. Wu, X.T. Liu, J. Magnes. Alloy. 8, 396 (2020)

    Article  CAS  Google Scholar 

  35. Y.J. Xu, D. Casari, Q. Du, R.H. Mathiesen, L. Arnberg, Y.J. Li, Acta Mater. 140, 224 (2017)

    Article  CAS  Google Scholar 

  36. Z.J. Xuan, F. Mao, Z.Q. Cao, T.M. Wang, L.J. Zou, J. Alloys Compd. 721, 126 (2017)

    Article  CAS  Google Scholar 

  37. H. Yasuda, K. Morishita, M. Yoshiya, T. Narumi, ISIJ Int. 60, 2755 (2020)

    Article  CAS  Google Scholar 

  38. H. Yasuda, T. Nagira, M. Yoshiya, A. Sugiyama, N. Nakatsuka, M. Kiire, M. Uesugi, K. Uesugi, K. Umetani, K. Kajiwara, Massive transformation from delta phase to gamma phase in Fe-C alloys and strain induced in solidifying shell. In Mcwasp **ii: International Conference on Modeling of Casting, Welding and Advanced Solidification Processes ed. by A. Ludwig (2012)

  39. H. Yasuda, T. Nagira, M. Yoshiya, M. Uesugi, N. Nakatsuka, M. Kiire, A. Sugiyama, K. Uesugi, K. Umetani, Iop, In-situ observation of peritectic solidification in Sn-Cd and Fe-C alloys. In 3rd International Conference on Advances in Solidification Processes (2012)

  40. H. Yasuda, Y. Yamamoto, N. Nakatsuka, M. Yoshiya, T. Nagira, A. Sugiyama, I. Ohnaka, K. Uesugi, K. Umetani, Int. J. Cast Met. Res. 22, 15 (2009)

    Article  CAS  Google Scholar 

  41. H. Yasuda, Y. Yamamoto, N. Nakatsuka, M. Yoshiya, T. Nagira, A. Sugiyama, I. Ohnaka, K. Uesugi, K. Umetani, Observation of the Segregation by using Time-resolved X-ray Imaging (2009)

  42. G. Zeng, K. Nogita, S. Belyakov, J.W. **an, S.D. McDonald, K.V. Yang, H. Yasuda, C.M. Gourlay, Real-time observation of AZ91 solidification by synchrotron radiography. In Magnesium Technology 2017 ed. by K.N. Solanki, D. Orlov, A. Singh, N.R. Neelameggham (2017), pp. 597

  43. Z. Ding, N. Zhang, L. Yu, W. Lu, J. Li, Q. Hu, A.C.T.A. Metall, Sin.-Engl. Lett. 34, 145 (2021)

    CAS  Google Scholar 

  44. J.W. **an, S.A. Belyakov, M. Ivier, K. Nogita, H. Yasuda, C.M. Gourlay, Acta Mater. 126, 540 (2017)

    Article  CAS  Google Scholar 

  45. J.W. **an, M.A.A.M. Salleh, S.A. Belyakov, T.C. Su, G. Zeng, K. Nogita, H. Yasuda, C.M. Gourlay, Intermetallics 102, 34 (2018)

    Article  CAS  Google Scholar 

  46. H. Yasuda, T. Nagira, M. Yoshiya, N. Nakatsuka, A. Sugiyama, K. Uesugi, K. Umetani, ISIJ Int. 51, 402 (2011)

    Article  CAS  Google Scholar 

  47. G. Zeng, S.D. McDonald, D. Mu, Y. Terada, H. Yasuda, Q. Gu, M.A.A.M. Salleh, K. Nogita, J. Alloys Compd. 685, 471 (2016)

    Article  CAS  Google Scholar 

  48. C.M. Gourlay, S.A. Belyakov, Z.L. Ma, J.W. **an, JOM 67, 2383 (2015)

    Article  CAS  Google Scholar 

  49. A.A. Daszki, C.M. Gourlay, J. Electron. Mater. 50, 808 (2020)

    Article  Google Scholar 

  50. Z.L. Ma, J.W. **an, S.A. Belyakov, C.M. Gourlay, Acta Mater. 150, 281 (2018)

    Article  CAS  Google Scholar 

  51. J.W. **an, Z.L. Ma, S.A. Belyakov, M. Ollivier, C.M. Gourlay, Acta Mater. 123, 404 (2017)

    Article  CAS  Google Scholar 

  52. H. Shang, Z.L. Ma, S.A. Belyakov, C.M. Gourlay, J. Alloys Compd. 715, 471 (2017)

    Article  CAS  Google Scholar 

  53. B. Arfaei, M. Benedict, E.J. Cotts, J. Appl. Phys. 114, 173506 (2013)

    Article  Google Scholar 

  54. B. Arfaei, N. Kim, E.J. Cotts, J. Electron. Mater. 41, 362 (2012)

    Article  CAS  Google Scholar 

  55. L.P. Lehman, Y. **ng, T.R. Bieler, E.J. Cotts, Acta Mater. 58, 3546 (2010)

    Article  CAS  Google Scholar 

  56. B. Arfaei, The Effects of Nucleation and Solidification Mechanisms on the Microstructure and Thermomechanical Response of Sn-Ag-Cu Solder Joints (State University of New York at Binghamton, Ann Arbor, 2010), p. 201

    Google Scholar 

  57. M.G. Cho, S.K. Kang, H.M. Lee, J. Mater. Res. 23, 1147 (2008)

    Article  CAS  Google Scholar 

  58. L.P. Lehman, S.N. Athavale, T.Z. Fullem, A.C. Giamis, R.K. Kinyanjui, M. Lowenstein, K. Mather, R. Patel, D. Rae, J. Wang, Y. **ng, L. Zavalij, P. Borgesen, E.J. Cotts, Growth of Sn and Intermetallic Compounds in Sn-Ag-Cu Solder (Springer, New York LLC, 2004), p. 1429

    Google Scholar 

  59. Z.L. Ma, S.A. Belyakov, C.M. Gourlay, J. Alloys Compd. 682, 326 (2016)

    Article  CAS  Google Scholar 

  60. J.W. **an, S.A. Belyakov, T.B. Britton, C.M. Gourlay, J. Alloys Compd. 619, 345 (2015)

    Article  CAS  Google Scholar 

  61. S.A. Belyakov, C.M. Gourlay, Intermetallics 37, 32 (2013)

    Article  CAS  Google Scholar 

  62. G. Parks, M. Lu, E. Perfecto, E. Cotts, Controlling the Sn Grain Morphology of SnAg C4 Solder Bumps (Institute of Electrical and Electronics Engineers Inc., New Jersey, 2014), p. 690

    Google Scholar 

  63. Q.K. Zhang, Z.F. Zhang, Acta Mater. 59, 6017 (2011)

    Article  CAS  Google Scholar 

  64. J. Han, F. Guo, J.P. Liu, J. Mater. Sci. Mater. Electron. 28, 6572 (2017)

    Article  CAS  Google Scholar 

  65. Z.L. Ma, S.A. Belyakov, K. Sweatman, T. Nishimura, T. Nishimura, C.M. Gourlay, Nat. Commun. 8, 1916 (2017)

    Article  CAS  Google Scholar 

  66. S. McDonald, K. Nogita, J. Read, T. Ventura, T. Nishimura, J. Electron. Mater. 42, 256 (2013)

    Article  CAS  Google Scholar 

  67. T. Laurila, V. Vuorinen, M. Paulasto-Krockel, Mater. Sci. Eng. R-Rep. 68, 1 (2010)

    Article  Google Scholar 

  68. C. Gourlay, S. Belyakov, G. Zeng, H. Yasuda, K. Nogita, Solidification of Sn-0.7 Cu-0.05 Ni solder. In Pb-free Solders and Emerging Interconnect and Packaging Technologies-TMS 2013 142nd Annual Meeting and Exhibition (2013)

  69. T. Ventura, S. Terzi, M. Rappaz, A.K. Dahle, Acta Mater. 59, 1651 (2011)

    Article  CAS  Google Scholar 

  70. T. Ventura, S. Terzi, M. Rappaz, A.K. Dahle, Acta Mater. 59, 4197 (2011)

    Article  CAS  Google Scholar 

  71. T. Ventura, Y.-H. Cho, C. Kong, A.K. Dahle, J. Electron. Mater. 40, 1403 (2011)

    Article  CAS  Google Scholar 

  72. M. Felberbaum, T. Ventura, M. Rappaz, A.K. Dahle, JOM 63, 52 (2011)

    Article  CAS  Google Scholar 

  73. C.M. Gourlay, K. Nogita, S.D. McDonald, T. Nishimura, K. Sweatman, A.K. Dahle, Scr. Mater. 54, 1557 (2006)

    Article  CAS  Google Scholar 

  74. C.M. Gourlay, K. Nogita, J. Read, A.K. Dahle, J. Electron. Mater. 39, 56 (2010)

    Article  CAS  Google Scholar 

  75. C.M. Gourlay, J. Read, K. Nogita, A.K. Dahle, J. Electron. Mater. 37, 51 (2008)

    Article  CAS  Google Scholar 

  76. W. Ng, G. Zeng, T. Nishimura, K. Sweatman, S.D. McDonald, K. Nogita, The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. In 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IACC) (2015), p. 809

  77. J. Machida, H. Esaka, M. Tamura, K. Shinozuka, J. Jpn. Inst. Met. 70, 73 (2006)

    Article  CAS  Google Scholar 

  78. E. Çadırlı, U. Böyük, S. Engin, H. Kaya, N. Maraşlı, A. Ülgen, J. Alloys Compd. 486, 199 (2009)

    Article  Google Scholar 

  79. L.R. Garcia, W.R. Osorio, A. Garcia, Mater. Des. 32, 3008 (2011)

    Article  CAS  Google Scholar 

  80. J.C. Gong, C.Q. Liu, P.P. Conway, V.V. Silberschmidt, Mater. Sci. Eng. Struct. Mater. Prop. Microstruct. Process. 527, 2588 (2010)

    Article  Google Scholar 

  81. D.W. Henderson, T. Gosselin, A. Sarkhel, S.K. Kang, W.K. Choi, D.Y. Shih, C. Goldsmith, K.J. Puttlitz, J. Mater. Res. 17, 2775 (2002)

    Article  CAS  Google Scholar 

  82. S.K. Kang, D.Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S.I. Cho, J. Yu, W.K. Choi, JOM 56, 34 (2004)

    Article  CAS  Google Scholar 

  83. H.T. Lee, Y.F. Chen, J. Alloys Compd. 509, 2510 (2011)

    Article  CAS  Google Scholar 

  84. D.A. Shnawah, M.F.M. Sabri, I.A. Badruddin, S.B.M. Said, M.B.A. Bashir, N.M. Sharif, M.H. Elsheikh, J. Alloys Compd. 622, 184 (2015)

    Article  CAS  Google Scholar 

  85. J.W. **an, S.A. Belyakov, C.M. Gourlay, J. Electron. Mater. 50, 786 (2021)

    Article  CAS  Google Scholar 

  86. Y. Takamatsu, H. Esaka, K. Shinozuka, Mater. Trans. 52, 189 (2011)

    Article  CAS  Google Scholar 

  87. W.J. Boettinger, C.A. Handwerker, U.R. Kattner, Reactive wetting and intermetallic formation, in: The Mechanics of Solder Alloy Wetting and Spreading, Springer, 1993, pp. 103.

  88. G. Zeng, S.B. Xue, L. Zhang, L.L. Gao, J. Mater. Sci. Mater. Electron. 22, 565 (2011)

    Article  CAS  Google Scholar 

  89. G. Zeng, S. Xue, L. Zhang, L. Gao, W. Dai, J. Luo, J. Mater. Sci. Mater. Electron. 21, 421 (2010)

    Article  CAS  Google Scholar 

  90. S. Kumar, C.A. Handwerker, M.A. Dayananda, J. Phase Equilibria Diffus. 32, 309 (2011)

    Article  CAS  Google Scholar 

  91. K. Tu, Acta Metall. 21, 347 (1973)

    Article  CAS  Google Scholar 

  92. K.N. Tu, R.D. Thompson, Acta Metall. 30, 947 (1982)

    Article  CAS  Google Scholar 

  93. K. Tu, Mater. Chem. Phys. 46, 217 (1996)

    Article  CAS  Google Scholar 

  94. A.M. Gusak, K.N. Tu, Phys. Rev. B Condens. Matter 66, (2002)

  95. K.J. Zeng, R. Stierman, T.C. Chiu, D. Edwards, K. Ano, K.N. Tu, J. Appl. Phys. 97, 024508 (2005)

    Article  Google Scholar 

  96. J.C. Gong, C.Q. Liu, P.P. Conway, V.V. Silberschmidt, Acta Mater. 56, 4291 (2008)

    Article  CAS  Google Scholar 

  97. J.C. Gong, C.Q. Liu, P.P. Conway, V.V. Silberschmidt, Scr. Mater. 60, 333 (2009)

    Article  CAS  Google Scholar 

  98. K.C. Huang, F.-S. Shieu, Y.H. Hsiao, C.Y. Liu, J. Electron. Mater. 41, 172 (2011)

    Article  Google Scholar 

  99. C.E. Ho, C.R. Kao, K.N. Tu, Interfacial reactions and electromigration in flip-chip solder joints, in Advanced Flip Chip Packaging. ed. by H.M. Tong, Y.S. Lai, C.P. Wong (Springer, US, 2013), p. 503

    Chapter  Google Scholar 

  100. B. Chao, S.H. Chae, X.F. Zhang, K.H. Lu, J. Im, P.S. Ho, Acta Mater. 55, 2805 (2007)

    Article  CAS  Google Scholar 

  101. R. Labie, W. Ruythooren, J. Van Humbeeck, Intermetallics 15, 396 (2007)

    Article  CAS  Google Scholar 

  102. T. Laurila, V. Vuorinen, J.K. Kivilahti, Mater. Sci. Eng. R Rep. 49, 1 (2005)

    Article  Google Scholar 

  103. C.E. Ho, S.C. Yang, C.R. Kao, J. Mater. Sci. Mater. Electron. 18, 155 (2006)

    Article  Google Scholar 

  104. M. He, A. Kumar, P.T. Yeo, G.J. Qi, Z. Chen, Thin Solid Films 462, 387 (2004)

    Article  Google Scholar 

  105. S.-W. Chen, C.-H. Wang, J. Mater. Res. 21, 2270 (2011)

    Article  Google Scholar 

  106. C. Wang, S. Chen, Acta Mater. 54, 247 (2006)

    Article  CAS  Google Scholar 

  107. J.W. Yoon, S.W. Kim, S.B. Jung, J. Alloys Compd. 391, 82 (2005)

    Article  CAS  Google Scholar 

  108. Y.C. Huang, S.W. Chen, W. Gierlotka, C.H. Chang, J.C. Wu, J. Mater. Res. 22, 2924 (2007)

    Article  CAS  Google Scholar 

  109. M.J. Rizvi, C. Bailey, Y.C. Chan, M.N. Islam, H. Lu, J. Alloys Compd. 438, 122 (2007)

    Article  CAS  Google Scholar 

  110. J.Y. Tsai, Y.C. Hu, C.M. Tsai, C.R. Kao, J. Electron. Mater. 32, 1203 (2003)

    Article  CAS  Google Scholar 

  111. C.R. Yang, F.B. Song, S.W.R. Lee, Microelectron. Reliab. 54, 435 (2014)

    Article  CAS  Google Scholar 

  112. T. Laurila, J. Hurtig, V. Vuorinen, J.K. Kivilahti, Microelectron. Reliab. 49, 242 (2009)

    Article  CAS  Google Scholar 

  113. Y.W. Wang, Y.W. Lin, C.T. Tu, C.R. Kao, J. Alloys Compd. 478, 121 (2009)

    Article  CAS  Google Scholar 

  114. S.A. Belyakov, J.W. **an, K. Sweatman, T. Nishimura, T. Akaiwa, C.M. Gourlay, J. Alloys Compd. 701, 321 (2017)

    Article  CAS  Google Scholar 

  115. H. Tsukamoto, T. Nishimura, S. Suenaga, S.D. McDonald, K.W. Sweatman, K. Nogita, Microelectron. Reliab. 51, 657 (2011)

    Article  CAS  Google Scholar 

  116. M.G. Cho, S.K. Kang, S.K. Seo, D.Y. Shih, H.M. Lee, J. Electron. Mater. 38, 2242 (2009)

    Article  CAS  Google Scholar 

  117. S.L. Ngoh, W. Zhou, J.H.L. Pang, J. Electron. Mater. 37, 1843 (2008)

    Article  CAS  Google Scholar 

  118. K. Nogita, T. Nishimura, Scr. Mater. 59, 191 (2008)

    Article  CAS  Google Scholar 

  119. K. Nogita, C.M. Gourlay, T. Nishimura, JOM 61, 45 (2009)

    Article  CAS  Google Scholar 

  120. K. Nogita, Intermetallics 18, 145 (2010)

    Article  CAS  Google Scholar 

  121. U. Schwingenschlogl, C. Di Paola, K. Nogita, C. Gourlay, Appl. Phys. Lett. 96, 061908 (2010)

    Article  Google Scholar 

  122. D. Mu, J. Read, Y. Yang, K. Nogita, J. Mater. Res. 26, 2660 (2011)

    Article  CAS  Google Scholar 

  123. K. Nogita, C.M. Gourlay, S.D. McDonald, Y.Q. Wu, J. Read, Q.F. Gu, Scr. Mater. 65, 922 (2011)

    Article  CAS  Google Scholar 

  124. K. Nogita, D. Mu, S.D. McDonald, J. Read, Y.Q. Wu, Intermetallics 26, 78 (2012)

    Article  CAS  Google Scholar 

  125. Y.Q. Wu, J.C. Barry, T. Yamamoto, Q.F. Gu, S.D. McDonald, S. Matsumura, H. Huang, K. Nogita, Acta Mater. 60, 6581 (2012)

    Article  CAS  Google Scholar 

  126. H.Y. Hsiao, C.M. Liu, H.W. Lin, T.C. Liu, C.L. Lu, Y.S. Huang, C. Chen, K.N. Tu, Science 336, 1007 (2012)

    Article  CAS  Google Scholar 

  127. A.K. Larsson, L. Stenberg, S. Lidin, Acta Crystallogr. Sect. B Struct. Sci. 50, 636 (1994)

    Article  Google Scholar 

  128. J. Chen, Y.S. Lai, P.F. Yang, C.Y. Ren, D.J. Huang, J. Mater. Res. 24, 2361 (2009)

    Article  CAS  Google Scholar 

  129. R.A. Gagliano, G. Ghosh, M.E. Fine, J. Electron. Mater. 31, 1195 (2002)

    Article  CAS  Google Scholar 

  130. L. Jiang, N. Chawla, Scr. Mater. 63, 480 (2010)

    Article  CAS  Google Scholar 

  131. N.T.S. Lee, V.B.C. Tan, K.M. Lim, Appl. Phys. Lett. 88, 031913 (2006)

    Article  Google Scholar 

  132. A. Gangulee, G.C. Das, M.B. Bever, Metall. Mater. Trans. B 4, 2063 (1973)

    Article  CAS  Google Scholar 

  133. B. Peplinski, G. Schulz, D. Schultze, E. Schierhorn, Mater. Sci. Forum 228, 577 (1996)

    Article  Google Scholar 

  134. G. Ghosh, M. Asta, J. Mater. Res. 20, 3102 (2005)

    Article  CAS  Google Scholar 

  135. A. Leineweber, C. Wieser, W. Hugel, Scr. Mater. 183, 66 (2020)

    Article  CAS  Google Scholar 

  136. C. Wieser, W. Hügel, A. Walnsch, A. Leineweber, J. Electron. Mater. 49, 245 (2019)

    Article  Google Scholar 

  137. A. Leineweber, M. Loffler, S. Martin, J. Electron. Mater. 50, 5898 (2021)

    Article  CAS  Google Scholar 

  138. G. Zeng, S.D. McDonald, J.J. Read, Q.F. Gu, K. Nogita, Acta Mater. 69, 135 (2014)

    Article  CAS  Google Scholar 

  139. N. Saunders, A.P. Miodownik, Bull. Alloy Phase Diagr. 11, 278 (1990)

    Article  CAS  Google Scholar 

  140. P. Franke, D. Neuschütz, Binary Systems. Part 3: Binary Systems from Cs-K to Mg-Zr (Springer, Berlin, 2005)

    Book  Google Scholar 

  141. K. Nogita, M.A.A.M. Salleh, E. Tanaka, G. Zeng, S.D. Mcdonald, S. Matsumura, JOM 68, 2871 (2016)

    Article  CAS  Google Scholar 

  142. F. Somidin, H. Maeno, M.A.A.M. Salleh, X.Q. Tran, S.D. McDonald, S. Matsumura, K. Nogita, Mater. Charact. 138, 113 (2018)

    Article  CAS  Google Scholar 

  143. F. Somidin, H. Maeno, X.Q. Tran, D. McDonald, M.A.A. Mohd Salleh, S. Matsumura, K. Nogita, Materials 11, 2229 (2018)

    Article  Google Scholar 

  144. Z. Luo, L. Wang, Q. Fu, C. Cheng, J. Zhao, J. Mater. Res. 26, 1468 (2011)

    Article  CAS  Google Scholar 

  145. F. Somidin, H. Maeno, T. Toriyama, S.D. McDonald, W. Yang, S. Matsumura, K. Nogita, Materialia 9, 100530 (2020)

    Article  CAS  Google Scholar 

  146. W. Yang, T. Yamamoto, K. Aso, F. Somidin, K. Nogita, S. Matsumura, Scr. Mater. 158, 1 (2019)

    Article  CAS  Google Scholar 

  147. S.U. Mehreen, K. Nogita, S.D. McDonald, H. Yasuda, D.H. St John, Acta Mater. 220, 117295 (2021)

    Article  CAS  Google Scholar 

  148. D.K. Mu, S.D. McDonald, J. Read, H. Huang, K. Nogita, Curr. Opin. Solid State Mater. Sci. 20, 55 (2016)

    Article  CAS  Google Scholar 

  149. G. Zeng, S.D. McDonald, Q.F. Gu, S. Suenaga, Y. Zhang, J.H. Chen, K. Nogita, Intermetallics 43, 85 (2013)

    Article  CAS  Google Scholar 

  150. Y.Q. Wu, S.D. McDonald, J. Read, H. Huang, K. Nogita, Scr. Mater. 68, 595 (2013)

    Article  CAS  Google Scholar 

  151. G. Zeng, S.D. McDonald, Q.F. Gu, K. Nogita, J. Mater. Res. 27, 2609 (2012)

    Article  CAS  Google Scholar 

  152. J.W. **an, G. Zeng, S.A. Belyakov, Q. Gu, K. Nogita, C.M. Gourlay, Intermetallics 91, 50 (2017)

    Article  CAS  Google Scholar 

  153. S. Lidin, S.Y. Piao, Z. Anorg, Allg. Chem. 635, 611 (2009)

    Article  CAS  Google Scholar 

  154. C.Y. Yu, J.G. Duh, Scr. Mater. 65, 783 (2011)

    Article  CAS  Google Scholar 

  155. C.Y. Chou, S.W. Chen, Acta Mater. 54, 2393 (2006)

    Article  CAS  Google Scholar 

  156. F. Wang, X. Ma, Y. Qian, Scr. Mater. 53, 699 (2005)

    Article  CAS  Google Scholar 

  157. W. Yang, X.Q. Tran, T. Yamamoto, S. Yoshioka, F. Somidin, K. Nogita, S. Matsumura, Phys. Rev. Materials 4, 065002 (2020)

    Article  CAS  Google Scholar 

  158. G. Aurelio, S.A. Sommadossi, G.J. Cuello, J. Electron. Mater. 1 (2012)

  159. H.F. Zou, H.J. Yang, Z.F. Zhang, Acta Mater. 56, 2649 (2008)

    Article  CAS  Google Scholar 

  160. G. Aurelio, S.A. Sommadossi, G.J. Cuello, J. Appl. Phys. 112, 053520 (2012)

    Article  Google Scholar 

  161. M. Li, Z. Zhang, J. Kim, Appl. Phys. Lett. 98, 201901 (2011)

    Article  Google Scholar 

  162. W.Q. Shao, C.Y. Yu, W.C. Lu, J.G. Duh, S.O. Chen, Mater. Lett. 93, 300 (2013)

    Article  CAS  Google Scholar 

  163. N. Jiang, J. Clum, R. Chromik, E. Cotts, Scr. Mater. 37, 1851 (1997)

    Article  CAS  Google Scholar 

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Acknowledgements

Guang Zeng acknowledges the funding from the National Natural Science Foundation of China (No. 51904352), the Natural Science Foundation of Hunan Province (No. 2020JJ5758), and the State Key Laboratory of Solidification Processing in NPU (Grant No. SKLSP201904). The authors are grateful for funding from the University of Queensland-Nihon Superior Collaborative Research Programme (Grant No. 2016001895), the Australian Research Council (ARC) Discovery (DP200101949) and Linkage (LP180100595) grants. Hideyuki Yasuda acknowledges the financial support from JSPS KAKENHI (Grant No. JP17H06155) for develo** the observation technique and performing the time-resolve and in situ observations at SPring-8.

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Zeng, G., Liu, S., Gu, Q. et al. Investigation on the Solidification and Phase Transformation in Pb-Free Solders Using In Situ Synchrotron Radiography and Diffraction: A Review. Acta Metall. Sin. (Engl. Lett.) 35, 49–66 (2022). https://doi.org/10.1007/s40195-021-01350-x

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