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Longitudinal Ultrasonic Vibration Assisted Rapid Solid Phase Bonding of 2024 Aluminum Alloy Using Ag as Interlayer for Structure Lightweight Design

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Abstract

This paper introduced a method of rapid solid-phase bonding Al block with Ag as the intermediate layer by longitudinal ultrasonic vibration under eutectic temperature in the atmospheric environment. This method is suitable for the application of structural lightweight design. It was observed that Al and Ag diffuse with each other in the weld seam to form an intermetallic compound Ag2Al with close hexagonal structure. The effects of different reaction temperatures and ultrasonic vibration times on the microstructure and mechanical properties of intermetallic compound Ag2Al were discussed. The influence of the effect of ultrasonic softening waves on surface oxide film rupture and element diffusion was explored. With the increase of ultrasonic vibration time, the intermetallic compounds grew along with the interface and the thickness increased. When the welding temperature was 500 °C and the ultrasonic vibration was 20 s, the highest average strength of the welded joint reaches 46.68 MPa.

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All data generated or used during the study appear in the submitted article.

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Acknowledgements

This research was sponsored by the National Natural Science Foundation of China (Grant No. 51504165), the Tian** Sci. & Tec. Project (Grant No. 16JCQNJC02600).

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Correspondence to Qian Wang.

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No conflict of interest exits in the submission of this manuscript, and manuscript is approved by all authors for publication. I would like to declare on behalf of my co-authors that the work described was original research that has not been published previously, and not under consideration for publication elsewhere, in whole or in part. All the authors listed have approved the manuscript that is enclosed.

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Ning, B., Nie, Y., Wang, Q. et al. Longitudinal Ultrasonic Vibration Assisted Rapid Solid Phase Bonding of 2024 Aluminum Alloy Using Ag as Interlayer for Structure Lightweight Design. Met. Mater. Int. 27, 2059–2066 (2021). https://doi.org/10.1007/s12540-020-00891-7

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