Abstract
Solid-state diffusion bonding of pseudo-α-Ti alloy and Ti-stabilized stainless steel (SS321), with and without Ni interlayer, was investigated in the temperature range of 800-940 °C for different times. Microstructural investigation of the bond interfaces in the directly bonded diffusion couple showed a distinct diffusion zone which was composed of layers of (1) Fe-Ti intermetallic phases (Fe2Ti and FeTi), (2) transformed β-Ti and (3) (α+β) Ti. Shear strength of the joint was seen to be dependent on the thickness of diffusion zone and intermetallic phase layer. For direct diffusion bonding, maximum shear strength of 223.6 ± 17 MPa was observed for the joints processed at a temperature of 920 °C with a holding time of 8 min under a load corresponding to ~0.8 times yield strength (YS) of Ti alloy. Shear strength results showed that the optimum thickness of the Fe-Ti intermetallic phase layer is approximately 2 ± 0.5 µm. For the diffusion bonding joints in the presence of a Ni interlayer, formation of layers of Ni-Ti intermetallic compounds (Ni3Ti, NiTi and NiTi2) was observed at the interface between Ni and Ti alloys. Joint bonded at 940 °C with a holding time of 1 min under a load of 0.8 × YS showed the maximum shear strength of 180 ± 23 MPa. The optimum thickness of the Ni-Ti intermetallic layers for maximum shear strength was found to be approximately 5 ± 2 µm.
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Acknowledgments
The authors would like to acknowledge Dr. S. K Ghosh, SO/H, Dr R. N Singh, Head, Mechanical Metallurgy Division Dr. V. Kain, Director Materials Group of Materials group and Head CDM, BARC, for providing the laboratory facilities during the investigation. The author would also like to acknowledge Shri B.K Mishra for provided all the logistical help for carrying out the experiments and Shri Bhupendra Kumawat for hel** to carry out shear testing.
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Kumar, H., Bhattacharya, S. & Keskar, N.A. Solid-State Diffusion Bonding of Pseudo-α-Ti Alloy to Ti-Stabilized Stainless Steel: With and Without Interlayer. J. of Materi Eng and Perform 31, 7527–7538 (2022). https://doi.org/10.1007/s11665-022-06758-9
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DOI: https://doi.org/10.1007/s11665-022-06758-9