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Corrosion Protection of Cu Electrical Cable by W-Ni Composite Coatings Doped with TiO2 Nanoparticles: Influence of Pulse Currents

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Abstract

W-Ni-TiO2 nano-composite layers were electrodeposited on copper surface by both direct (DC) and pulse (PC) currents. The copper substrates are samples from the main electrical cable used for the Renault K-Z (the latest 100% electric vehicle). In order to investigate coating morphology, atomic force microscopy was used, while energy-dispersive x-ray analysis was applied to determine nano-composite composition. Based on surface morphology, the W-Ni-TiO2 (DC) alloy surface was covered by massive agglomerates, especially when the W-Ni-TiO2 (PC) nano-composite coating was more compact, thicker and exhibited smaller grain size. The coated surface revealed different contents such as 43.4 and 65.4% of W in DC and PC coatings, respectively, which are considered to be a novel composition of the W-Ni alloy. XRD studies revealed that the NiW2 phase only occurs in the W-Ni-TiO2 (PC) nano-composite alloy. Electrical and thermal conductivities, microhardness and porosity values are enhanced by the addition of TiO2 to the alloy.

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Authors and Affiliations

  1. Unité de Recherche Electrochimie, Matériaux et Environnement UREME (UR17ES45), Faculté des Sciences de Gabès, Université de Gabès, Cité Erriadh, 6072, Gabès, Tunisia

    W. Sassi & S. Ammar

  2. ENIT, Equipe de recherche Corrosion et Protection des Métalliques, Unité de Recherche énergétique-mécanique, Université de Tunis El Manar, Rue Béchir Salem Belkhiria Campus universitaire, BP 37, 1002, Belvédère, Tunisia

    L. Dhouibi

  3. Institut UTINAM, UMR 6214 CNRS Univ. Bourgogne Franche-Comté, 16 route de Gray, 25030, Besançon, France

    W. Sassi, J.-Y. Hihn, P. Berçot & M. Rezrazi

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  1. W. Sassi
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  4. P. Berçot
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Correspondence to W. Sassi.

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Sassi, W., Dhouibi, L., Hihn, JY. et al. Corrosion Protection of Cu Electrical Cable by W-Ni Composite Coatings Doped with TiO2 Nanoparticles: Influence of Pulse Currents. J. of Materi Eng and Perform 28, 5639–5648 (2019). https://doi.org/10.1007/s11665-019-04288-5

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  • DOI: https://doi.org/10.1007/s11665-019-04288-5

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