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Fabrication and Mechanical Characterization of Cold Extruded Aluminum Bronze Planar Microsprings

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Abstract

A microspring is an important actuating component used widely in micro-electromechanical systems. It is important to develop microforming techniques for high-fatigue life microsprings manufactured. In this work, a micro-extrusion die was designed and manufactured for a plane microspring, and a CuAl7 copper alloy plane microspring was fabricated by cold extrusion. Effects of pre-annealing treatment, extrusion velocity, and lubrication conditions on the extrusion loading, surface crack and fatigue life of the spring were studied. The spring microstructure was characterized by equiaxed grains on the spring ends, and elongated grains exhibited the spring interior. Both internal and surface cracks were present in the springs. A good lubrication condition, an appropriate pre-annealing treatment, and a suitable extrusion velocity would reduce surface cracks. The fatigue life of the spring extruded at higher velocity was larger than that extruded at lower velocity under the same surface crack density. The fatigue life decreased with increasing annealing treatment temperature and holding time. A good lubrication condition during the extrusion process would improve the fatigue life of the spring. The maximum fatigue life of these extruded microsprings was 19,260 cycles when the cycle force was 10 N.

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References

  1. Y. Suzuki, S. Ogihara, D. Hoshino, T. Morita, Y. Chida, H. Katsumata, T. Fujiya, Z.F. Duan, and Y. Nishioka, Comparison of Polypyrrole Organic Thin Film Actuators with or Without Silicon Microspring, Mol. Cryst. Liq. Cryst., 2011, 539, p 488–495

    Google Scholar 

  2. Y. Chida, H. Katsumata, T. Fujiya, S. Kaihatsu, T. Morita, D. Hoshino, and Y. Nishioka, Silicon Linear Actuator Driven by Electrochemomechanical Strain of Polypyrrole Film, Sens. Actuat. A Phys., 2011, 169(2), p 367–372

    Article  Google Scholar 

  3. E.B. Liao, A.O. Tay Andrew, S.T. Ang Simon, H.H. Feng, R. Nagarajan, V. Kripesh, R. Kumar, and G.Q. Lo, Planar microspring—A Novel Compliant Chip-to-Package Interconnect for Wafer-Level Packaging. IEEE T. Adv. Packag., 2009, 32(2), p 379–389

  4. B. Liu, Z.Q. Lv, X.J. He, M. Liu, Y.L. Hao, and Z.H. Li, Improving Performance of the Metal-to-Metal Contact RF MEMS Switch with a Pt-Au Microspring Contact Design, J. Micromech. Microeng. doi:10.1088/0960-1317/21/6/065038

  5. H. Li and G.C. Shi, Analysis of Application Patterns of Z-Type MEMS Microspring, Microsyst. Technol., 2009, 15(4), p 527–533

    Article  Google Scholar 

  6. Y. Saotome, S. Yokote, and T. Okamoto, Design and Insitu Mechanical Testing System for Probecard/UV-LIGA-Ni Microspring, Kyoto, IEEE The Sixteenth Annual International. Conference on Micro Electro Mechanical Systems, 2003, p 670–673

  7. K. Yoshida, and H. Onoe, Self-Assembled Hydrogel Microspring for Soft Actuator, 2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015

  8. S. Khumpuang, A. Ohtomo, K. Miyake, and T. Itoh, Fabrication and Evaluation of a Microspring Contact Array Using a Reel-to-Reel Continuous Fiber Process, J. Micromech. Microeng. doi:10.1088/0960-1317/21/10/105019

  9. B.W. Cheng, B. De, C. Dirk, S. Chris, S. Kunal, C. Ivan, E. John, Y. Luo, K.F. Bohringer, A.V. Krishnamoorthy, and E.M. Chow, Microspring Characterization and Flip-Chip Assembly Reliability, IEEE T. Comp. Pack. Man., 2013, 3(2), p 187–196

    Google Scholar 

  10. S.M. Yang, X.Q. Chen, K. Yamamoto, M. Litake, D. Nishio-Hamane, H. Sakai, and M. Abe, Electrically Conductive and Mechanically Elastic Titanium Nitride Ceramic Microsprings, J. Nanosci. Nanotechnol., 2014, 14(6), p 4292–4296

    Article  Google Scholar 

  11. J.N. **e and V.K. Varadan, Synthesis of High Yield Single Helical Carbon Microsprings by Catalytic Chemical Vapor Deposition and an Experimental Investigation of Their Growth Mechanism, J. Appl. Phys., 2007, 101(11), p 114903

    Article  Google Scholar 

  12. T. Huang, Z.Q. Liu, G.S. Huang, R. Liu, and Y.F. Mei, Grating-Structured Metallic Microsprings, Nanoscale, 2014, 6(16), p 9428–9435

    Article  Google Scholar 

  13. X.H. Dong, F. Chen, S. Chen, Y. Liu, Z.Y. Huang, H. Chen, S.F. Feng, L. Zhao, Z.L. Wu, and X.P. Zhang, Microstructure and Microhardness of Hot Extruded 7075 Aluminum Alloy Micro-Gear, J. Mater. Process. Technol., 2015, 219, p 199–208

    Article  Google Scholar 

  14. S.Y. Ding, and S. **, Microbulging Extrusion of Aluminum Alloy to Fabricate Micro/Meso Features for Heat Pipes, Int. J. Adv. Manuf. Technol. doi:10.1007/s00170-016-8384-z

  15. D. Rajenthirakumar, R. Sridhar, R. Abenethiri, R. Kartik, and D. Bagri, Experimental Investigations of Grain Size Effects in Forward Microextrusion, Int. J. Adv. Manuf. Technol. doi:10.1007/s00170-015-7497-0

  16. C.C. Chen, Grain-Size Effect on the Forging Formability of Mini Gears, Int. J. Adv. Manuf. Technol., 2015, 79(5), p 863–871

    Article  Google Scholar 

  17. F. Chen, S. Chen, X.H. Dong, C.Y. Li, X.T. Hong, and X.P. Zhang, Size Effects on Tensile Strength of Aluminum-Bronze Alloy at Room Temperature, Mater. Des., 2015, 85(15), p 778–784

    Article  Google Scholar 

  18. P. Tiernan, B. Draganescu, and M.T. Hillery, Modelling of Extrusion Force Using the Surface Response Method, Int. J. Adv. Manuf. Technol., 2005, 27(1), p 48–52

    Article  Google Scholar 

  19. X.H. Dong, X.T. Hong, F. Chen, B.R. Sang, W. Yu, and X.P. Zhang, Effects of Specimen and Grain Sizes on Compression Strength of Annealed Wrought Copper Alloy at Room Temperature, Mater. Des., 2014, 64, p 400–406

    Article  Google Scholar 

  20. S.C.V. Lim and A.D. Rollett, Length Scale Effects on Recrystallization and Texture Evolution in Cu Layers of a Roll-Bonded Cu-Nb Composite, Mater. Sci. Eng. A, 2009, 520, p 189–196

    Article  Google Scholar 

  21. J.C. Pang, S.X. Li, Z.G. Wang, and Z.F. Zhang, General Relation Between Ultimate Tensile Strength and Fatigue Strength of Metallic Materials. Mater. Sci. Eng. A 2013, 564, p 331–341

  22. P. Zhang, S.X. Li, and Z.F. Zhang, General Relationship Between Strength and Hardness, Mater. Sci. Eng. A, 2011, 529, p 62–73

    Article  Google Scholar 

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Acknowledgments

This work was supported by the National Natural Science Foundation of China, No. 51675283; Jiangsu National Natural Science Foundation, No. BK20151489; Scientific Research Foundation for the Returned Overseas Chinese Scholars, State Education Ministry; the Fundamental Research Funds for the Central Universities, No. 30920140112008; and SAST, No. 2015044.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Nan**g University of Science and Technology, ** Zhang

  2. College of Science, Nan**g University of Science and Technology, **aolingwei 200, Nan**g, 210094, China

    Xuehua Dong

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  1. Jiuming Lv
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  2. Fangyi Hu
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  3. Quoc Dinh Cao
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  4. **angting Hong
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  5. Xuehua Dong
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  6. ** Zhang
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Correspondence to Xuehua Dong or ** Zhang.

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Lv, J., Hu, F., Cao, Q.D. et al. Fabrication and Mechanical Characterization of Cold Extruded Aluminum Bronze Planar Microsprings. J. of Materi Eng and Perform 26, 2919–2927 (2017). https://doi.org/10.1007/s11665-017-2688-5

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  • DOI: https://doi.org/10.1007/s11665-017-2688-5

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