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Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni

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Abstract

Au-Ge-based alloys are potential substitutes for Pb-rich solders currently used for high-temperature applications. In the present work, the wetting behavior of two Au-Ge-X (X = Sb, Sn) ternary alloys, i.e., Au-15Ge-17Sb and Au-13.7 Ge-15.3Sn (at.%), in contact with Cu and Ni substrates has been investigated. Au-13.7Ge-15.3Sn alloy showed complete wetting on both Cu and Ni substrates. Total spreading of Au-15Ge-17Sb alloy on Cu was also observed, while the final contact angle of this alloy on Ni was about 29°. Pronounced dissolution of Cu substrates into the solder alloys investigated was detected, while the formation of Ni-Ge intermetallic compounds at the interface of both solder/Ni systems suppressed the dissolution of Ni into the solder.

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Authors and Affiliations

  1. Empa – Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Joining Technologies and Corrosion, Überlandstrasse 129, 8600, Dübendorf, Switzerland

    S. ** & C. Leinenbach

  2. Computational Materials Laboratory, Ecole Polytechnique Fédérale de Lausanne, Station 12, 1015, Lausanne, Switzerland

    S. **

  3. National Research Council (CNR), Institute for Energetics and Interphases (IENI), 16149, Genoa, Italy

    F. Valenza & R. Novakovic

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  1. S. **
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  2. F. Valenza
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  3. R. Novakovic
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  4. C. Leinenbach
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Correspondence to C. Leinenbach.

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**, S., Valenza, F., Novakovic, R. et al. Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni. J. Electron. Mater. 42, 1024–1032 (2013). https://doi.org/10.1007/s11664-013-2497-z

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  • DOI: https://doi.org/10.1007/s11664-013-2497-z

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