Abstract
The influence of dielectric stress on the direct current (DC) electrical characteristics of AlGaN/GaN heterostructure field-effect transistors (HFETs) has been investigated. Dual-frequency plasma deposition was used to vary the amount of stress induced by a passivating dielectric on the surface of the devices. Initial data suggested a strong influence from the induced dielectric stress, but the low-frequency, radio-frequency (RF) excitation of the plasma deposition process was found to induce a severe nonreversible damage to the exposed AlGaN surface through N ion bombardment. The consequence is a drastic reduction of the sheet carrier concentration and mobility of the two-dimensional electron gas (2DEG). Subsequently, an alternative damage-free technique using a helium precursor was used to obtain compressive films. Based on the results, uniform dielectric stress has a minimal impact on the polarization charges within the AlGaN barrier.
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Tan, W.S., Houston, P.A., Hill, G. et al. Influence of dual-frequency plasma-enhanced chemical-vapor deposition Si3N4 passivation on the electrical characteristics of AlGaN/GaN heterostructure field-effect transistors. J. Electron. Mater. 33, 400–407 (2004). https://doi.org/10.1007/s11664-004-0191-x
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DOI: https://doi.org/10.1007/s11664-004-0191-x