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Interfacial microstructure and intermetallics developed in the interface between in solders and Au/Ni/Ti thin films during reflow process

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Abstract

Intermetallic phases and microstructures formed between In solder and Au/Ni/Ti thin films during reflow were characterized using x-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). Two types of two-step heat treatment were performed in a rapid thermal annealing (RTA) system or in a furnace to simulate the flip-chip solder-joining process. The AuIn2 and In27Ni10 intermetallic phases were observed after the two-step heat treatment at the lower temperature. Additional In-Ni intermetallic layers formed between the In27Ni10 and Ni layer, which was two-step heat treated at the higher temperature. This phase was identified as metastable InNi of CsCl type with a=∼3.1 Å by convergent-beam electron diffraction (CBED).

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References

  1. J.T. Moon, S.H. Lee, K.J. Joo, H.T. Lee, M.G. Song, and K.A. Pyun, Kor. J. Mater. Res. 7, 330 (1997).

    CAS  Google Scholar 

  2. M. Mori, Y. Kizaki, M. Saito, and A. Hongu, IEEE Trans. Comp., Hydrids, Manuf. Technol. 16, 852 (1993).

    Article  CAS  Google Scholar 

  3. J.C. Hwang, IEEE Trans. Comp. Packag. Manuf. Technol. Part A 18, 458 (1995).

    Article  Google Scholar 

  4. J.H. Lau, Flip Chip Technologies (New York: McGraw-Hill, 1996), pp. 123–126.

    Google Scholar 

  5. R.R. Tummala, E.J. Rymaszewski, and A.G. Klopfenstein, Microelectronics Packaging Handbook Part II (New York: Chapman & Hall, 1997), pp. 129–185.

    Google Scholar 

  6. E.K. Yung and I. Turlik, 10th IEPS Conf. Proc. 1065 (1990).

  7. K. Mizuishi and T. Mori, IEEE Trans. Comp., Hybrids, Manuf. Technol. 11, 481 (1988).

    Article  Google Scholar 

  8. K.P. Gurov, V.N. Pimenov, and S.G. Radkovskiy, Russ. Metall. 3, 52 (1978).

    Google Scholar 

  9. C.R. Kao, Mater. Sci. Eng. A238, 200 (1997).

    Google Scholar 

  10. R. Davenaux and I. Turlik, IEEE Trans. Comp., Hydrids, Manuf. Technol. 13, 929 (1990).

    Article  Google Scholar 

  11. C.-Y. Lee, Y.-H. Kim, and C.S. Kim, J. Kor. Inst. Metal Mater. 35, 1395 (1997).

    CAS  Google Scholar 

  12. K.T. Puttlitz, IEEE Trans. Comp., Hydrids, Manuf. Technol. 13, 647 (1990).

    Article  Google Scholar 

  13. C.J. Chen and K.L. Lin, IEEE Trans. Comp. Packag. Manuf. Technol. Part B 20, 211 (1997).

    Article  CAS  Google Scholar 

  14. Y.H. Tseng, M.S. Yeh, and T.H. Chuang, J. Electron. Mater. 28, 105 (1999).

    CAS  Google Scholar 

  15. G.H. Kim, Bull. Kor. Inst. Metal Mater. 9, 633 (1996).

    Google Scholar 

  16. T.B. Massalski, Binary Alloy Phase Diagrams, vol. 2 (Metals Park, OH: ASM, 1986), p. 1386.

    Google Scholar 

Download references

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Authors and Affiliations

  1. Department of Metallurgy and Materials Science, Changwon National University, 641-773, Kyungnam, Korea

    Keesam Shin

  2. Department of Materials Engineering, Hanyang University, 133-791, Seoul, Korea

    Won-Gu Cho & Young-Ho Kim

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  1. Keesam Shin
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  2. Won-Gu Cho
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  3. Young-Ho Kim
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Shin, K., Cho, WG. & Kim, YH. Interfacial microstructure and intermetallics developed in the interface between in solders and Au/Ni/Ti thin films during reflow process. J. Electron. Mater. 32, 483–491 (2003). https://doi.org/10.1007/s11664-003-0130-2

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  • DOI: https://doi.org/10.1007/s11664-003-0130-2

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