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Preparation and Performance of Graphene Oxide Modified Polyurethane Thermal Conductive Insulating Adhesive

  • Organic Materials
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Abstract

A novel graphene oxide (GO) modified polyurethane thermal conductive insulating adhesive with small addition and excellent insulation properties was prepared by in-situ polymerization using GO as thermal conductive filler. The effects of GO content on the mechanical performance, thermal conductivity, thermal stability and insulation properties of the modified polyurethane adhesive were studied. The results showed that the tensile strength and elongation at break of polyurethane adhesive increased at first and then decreased with the increase of GO content. The thermal conductivity and thermal decomposition temperature of GO/PU composite adhesive can be effectively improved by adding appropriate amount of GO. The tensile strength, thermal conductivity and thermal decomposition temperature of polyurethane adhesive reached the maximum when GO content was 1.5 wt%. The novel GO-modified polyurethane adhesive exhibited good insulation property. The development of GO/PU thermal conductive adhesive will provide a facile method for effectively solving the “trade-off” problem between low filling and high thermal conductivity.

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Funding

Funded by the Liaoning Natural Science Fund Project (No.20180550432) and Liaoning Provincial Science and Technology Department Doctoral Research Start-Up Fund Project (No.2020-BS-158) and Liaoning Provincial Department of Education Fund Project (Nos.lnfw202014 and LJKQZ2021060)

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Authors and Affiliations

  1. School of Materials Science and Engineering, Shenyang Jianzhu University, Shenyang, 110168, China

    Yunxue Liu  (刘运学), **aotian Kang, Zhaorong Fan, Yaxin Gu & Peng Liu  (刘鹏)

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  1. Yunxue Liu  (刘运学)
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  2. **aotian Kang
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  3. Zhaorong Fan
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  4. Yaxin Gu
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  5. Peng Liu  (刘鹏)
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Correspondence to Peng Liu  (刘鹏).

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Liu, Y., Kang, X., Fan, Z. et al. Preparation and Performance of Graphene Oxide Modified Polyurethane Thermal Conductive Insulating Adhesive. J. Wuhan Univ. Technol.-Mat. Sci. Edit. 37, 1025–1031 (2022). https://doi.org/10.1007/s11595-022-2627-7

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  • DOI: https://doi.org/10.1007/s11595-022-2627-7

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