Abstract
Low permittivity materials are crucial for achieving high integration in circuit boards. While epoxy resins (EP) have excellent comprehensive properties, their permittivity does not meet the requirements for electronic packaging applications. In this study, we incorporated two types of Polyhedral oligomeric silsesquioxane (POSS) into EP and compared their effects on the dielectric, thermal, and mechanical properties of EP/POSS composites. The results demonstrate that EP/Ge-POSS composites exhibit superior dielectric properties compared to EP/Ao-POSS composites. Notably, the permittivity of EP/Ge-POSS composites is significantly reduced to 2.8, a 19% decrease compared to neat EP. Additionally, the mechanical properties of EP/Ge-POSS composites show remarkable improvement. For instance, the impact strength, bending strength, and tensile strength increase by 42.3%, 28.9%, and 18.9%, respectively, in EP/Ge-POSS-5wt% composites, compared to pure EP. The addition of Ge-POSS nano-particles has minimal impact on the thermal properties of the composites.
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The data that support the findings of this study are not openly available and are available from the corresponding author upon reasonable request.
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Acknowledgements
The authors wish to thank the support of the National Natural Science Foundation of China (Grant No. 51673154 and No. 52273254) and the Fundamental Research Funds for the Central Universities (Grant Number: 2023-vb-001).
Funding
This work was supported by The National Natural Science Foundation of China,51673154,Chuanxi **ong, Fundamental Research Funds for Central Universities of the Central South University,2023-vb-001,the National Natural Science Foundation of China,52273254,Chuanxi **ong.
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All authors made equal contributions to researching data, discussion, and analysis of the content of the manuscript. KS: writing-original draft, visualization, data curation, investigation. XZ: visualization. HQ: methodology investigation, data curation, formal analysis. CD: writing-review & editing. XN, DC, RF: supervision. KS: conceptualization, funding acquisition, supervision, writing-review & editing. KS and XZ contributed equally to this work.
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Shen, K., Zhang, X., Qin, H. et al. Epoxy resin/POSS nanocomposites with low permittivity and excellent mechanical properties. J Mater Sci: Mater Electron 35, 21 (2024). https://doi.org/10.1007/s10854-023-11758-z
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DOI: https://doi.org/10.1007/s10854-023-11758-z