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Rate-dependent mechanical properties of cured conductive adhesives and drop impact behavior of adhesive bonding points in electronic interconnection

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Abstract

Given the boom of portable electronic products and the increasing risk of drop impact load in electronic interconnection points, the rate-dependent mechanical properties of cured conductive adhesives and the drop impact behaviors of packaging structures interconnected with conductive adhesives with 50 and 60 wt% silver filler contents were investigated in this study. The quasi-static and dynamic compression stress–strain curves and deformation failure modes of cured conductive adhesives were obtained using an Instron universal material testing machine and a split Hopkinson pressure bar apparatus. The mechanical properties dependent on strain rate were characterized by Cowper–Symonds model. Numerical simulation of the drop impact behavior of the packaging structures was carried out by the general finite element software, LS-DYNA. Then, the von Mises stress and z-axis stress contours of the conductive adhesive interconnection joint array were constructed, and the critical adhesive joint was identified. The von Mises stress, z-axis stress, and maximum equivalent plastic strain of the critical adhesive joints for the cured conductive adhesives with 50 and 60 wt% silver filler content under different drop heights were acquired. Results showed the dependence of conductive adhesive interconnection joints on drop height and silver filler content.

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Data availability

The datasets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.

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Funding

This work was supported by the China Postdoctoral Science Foundation (Grant No. 2021M702605) and National Natural Science Foundation of China (Grant No. 11802198).

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Authors and Affiliations

  1. State Key Laboratory for Strength and Vibration of Mechanical Structures, School of Aerospace Engineering, **’an Jiaotong University, **’an, 710049, China

    Gesheng **ao, Tiejun Wang & **nkuo Ji

  2. Institute of Applied Mechanics, College of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Taiyuan, 030024, China

    Gesheng **ao, Xuefeng Shu & Yuhong Ma

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  1. Gesheng **ao
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  2. Tiejun Wang
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  3. Xuefeng Shu
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  5. **nkuo Ji
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Contributions

All authors contributed to the study conception and design. Material preparation, data collection, and analysis were performed by [GX] and [YM]. The first draft of the manuscript was written by [GX] and all authors commented on previous versions of the manuscript. All authors read and approved the final manuscript.

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Correspondence to Gesheng **ao.

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**ao, G., Wang, T., Shu, X. et al. Rate-dependent mechanical properties of cured conductive adhesives and drop impact behavior of adhesive bonding points in electronic interconnection. J Mater Sci: Mater Electron 33, 11946–11957 (2022). https://doi.org/10.1007/s10854-022-08157-1

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  • DOI: https://doi.org/10.1007/s10854-022-08157-1

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