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Thermal and electrical conductivity in Al–Si/Cu/Fe/Mg binary and ternary Al alloys

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Abstract

This study investigated 30Al–Si, Al–Cu, Al–Fe, Al–Mg, Al–10Si–Cu, Al–10Si–Fe, and Al–10Si–Mg binary and ternary Al alloys, which are among the most commonly used commercial alloys. The thermal and electrical conductivity of the gravity castings of these alloys were measured. The results indicated that when 1 wt% Si, Cu, or Fe was mixed with commercial Al with 99.8 % purity, the thermal conductivity decreased from 213.5 Wm−1 K−1 to approximately 190–210 Wm−1 K−1. The thermal conductivity remained at a nearly constant level of 154–157 Wm−1 K−1 when the Si concentration exceeded 6 wt% in the Al–Si alloys. Regarding the Al–Mg alloys, the thermal conductivity did not change when the concentration of Mg was increased to 1 wt%. When the concentration of Mg exceeded 1 wt%, the thermal conductivity decreased greatly from 212.1 Wm−1 K−1 in the Al–1wt%Mg to 124.1 Wm−1 K−1 in the Al–5wt%Mg. This decrease occurred because the Mg-rich phase continuously impeded heat transfer at the grain boundaries. For the ternary Al alloys, when 0–1 wt% Fe or Cu was added to Al–10Si, the thermal conductivity increased slightly from 154 Wm−1 K−1 in Al–10Si to 162.7 Wm−1 K−1. The increase was due to the inclusion of Fe, which led to the formation of an Al x Fe y Si phase, reducing the solutes in the matrix phase. When the composition, morphology, amount, and distribution of all precipitates along with the matrix phase were taken into account, the effective medium approximations accurately interpreted the thermal conductivities of the Al alloys. Electrical conductivities were also measured and compared with thermal conductivities estimated using the Wiedemann–Franz law, and the results indicated close agreement. The Wiedemann–Franz law, however, often underestimates the thermal conductivity in Al alloys containing a high level of Si.

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References

  1. Mallick PK (2010) Materials, design and manufacturing for lightweight vehicles. CRC Press, Raton

    Book  Google Scholar 

  2. Takahash K, Kuwahara H, Kawasaki N, Obata T, Sugawa E (2001) Enhancement of thermal contact conductance between metal surfaces in an induction motor. J Enhanc Heat Trans 8:201–213

    Article  Google Scholar 

  3. Kasprzak W, Sahoo M, Sokolowski J, Yamagata H, Kurita H (2009) The effect of the melt temperature and the cooling rate on the microstructure of the Al-20% Si alloy used for monolithic engine blocks. Int J Metalcast 3:55–71

    Google Scholar 

  4. Davis JR (2007) Aluminium and aluminum alloys, vol 6. ASM International, Materials Park

    Google Scholar 

  5. Kim CW, Cho JI, Choi SW, Kim YC (2013) The effect of alloying elements on thermal conductivity of aluminum alloys in high pressure die casting. Adv Mater Res 813:175–178

    Article  Google Scholar 

  6. Lumley RN, Deeva N, Larsen R, Gembarovic J, Freeman J (2013) The role of alloy composition and T7 heat treatment in enhancing thermal conductivity of aluminum high pressure diecastings. Metall Mater Trans A 44:1074–1086

    Article  Google Scholar 

  7. Pollock DD (1990) Physics of engineering materials. Prentice Hall, Englewood Cliffs, pp 198–207

    Google Scholar 

  8. Powell RW (1965) Correlation of metallic thermal and electrical conductivities for both solid and liquid phases. Int J Mass Trans 8:1033–1045

    Article  Google Scholar 

  9. Wang M, Pan N (2008) Predictions of effective physical properties of complex multiphase materials. Mater Sci Eng R 63:1–30

    Article  Google Scholar 

  10. Tiedje EW, Guo P (2014) Modeling the influence of particulate geometry on the thermal conductivity of composites. J Mater Sci 49:5586–5597

    Article  Google Scholar 

  11. Helsing J, Grimvall G (1991) Thermal conductivity of cast iron: models and analysis of experiments. J Appl Phys 70:1198–1206

    Article  Google Scholar 

  12. Stadler F, Antrekowitsch H, Fragner W, Kaufmann H, Pinatel ER, Uggowitzer PJ (2013) The effect of main alloying elements on the physical properties of Al–Si foundry alloys. Mater Sci Eng A560:481–491

    Article  Google Scholar 

  13. Cingi C, Rauta V, Orkas Suikanen EJ (2012) Effect of heat treatment on thermal conductivity of aluminum die casting alloys. Adv Mater Res 538–541:2047–2052

    Article  Google Scholar 

  14. Olafsson P, Sandstrom R, Karlsson A (1997) Comparison of experimental, calculated and observed values for electrical and thermal conductivity of aluminum alloys. J Mater Sci 32:4383–4390

    Article  Google Scholar 

  15. Gustafsson SE (1991) Transient plane source techniques for thermal conductivity and thermal diffusivity measurements of solid materials. Rev Sci Instrum 62:797–804

    Article  Google Scholar 

  16. Murray JL, McAlister AJ (1984) The Al-Si system. Bull Alloy Phase Diagr 5:74–84

    Article  Google Scholar 

  17. Aksöz S, Ocak Y, Maraşli N, Çadirli E, Kaya H, Bőyȕk U (2010) Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al-Cu alloys. Exp Therm Fluid Sci 34:1507–1516

    Article  Google Scholar 

  18. Wu J, Zhang H, Li J, Wang X (2012) Effect of copper content on the thermal conductivity and thermal expansion of Al-Cu/diamond composites. Mater Des 39:87–92

    Article  Google Scholar 

  19. Nagaumi H (2000) Effect of Mg contents on thermal properties of Al-Mg alloys. J Jpn Inst Light Met 50:49–53

    Article  Google Scholar 

  20. Taylor JA (2012) Iron-containing intermetallic phases in Al-Si based casting alloys. Proc Mater Sci 1:19–33

    Article  Google Scholar 

  21. Eleno L, Vezelý J, Sundman B, Cieslar M, Lacaze J (2010) Assessment of the Al corner of the ternary Al-Fe-Si system. Mater Sci For 649:523–528

    Google Scholar 

  22. Zhang Y, Wang X, Wu J (2009) In: Proceedings of international conference on electronic packaging technology and high density packaging, Bei**g, pp 708–712

  23. Chen JK, Huang IS (2013) Thermal properties of aluminum-graphite composites by powder metallurgy. Compos B 44:698–703

    Article  Google Scholar 

  24. Singh R (2011) Predictions of effective thermal conductivity of complex materials. In: Öchsner A, Murch GE (eds) Advanced structured materials, vol 2., Heat transfer in multi-phase materialsSpringer, Berlin, Heidelberg, pp 235–273

    Google Scholar 

  25. Guzman PAV, Sood A, Mleczko MJ, Wang B, Wong HSP, Nishi Y, Asheghi M, Goodson KE (2014) Cross plane thermal conductance of graphene-metal interfaces. In: Proceedings of 14th IEEE ITHERM conference, Orlando, FL, pp 1385–1389

  26. Uma S, McConnell AD, Asheghi M, Kurabayahi K, Goodson KE (2001) Temperature-dependent thermal conductivity of undoped polycrystalline silicon layers. Int J Thermophys 22:605–616

    Article  Google Scholar 

  27. Wei L, Vaudin M, Hwang CS, White G, Xu J, Steckl AJ (1995) Heat conduction in silicon thin films: effect of microstructure. J Mater Res 10:1889–1896

    Article  Google Scholar 

  28. Popčević P, Smontara A, Ivkov J, Wencka M, Komelj M, Jeglič P, Vrtnik S, Bobnar M, Jagličić Z, Bauer B (2010) Anisotropic physical properties of the Al13Fe4 complex intermetallic and its ternary derivative Al13(Fe,Ni)4. Phys Rev B 81:art no 184203

  29. Hatch JE (1984) Aluminium: properties and physical metallurgy. ASM International, Metals Park

    Google Scholar 

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Acknowledgements

The authors acknowledge the financial support provided by the Metal Industries Research and Development Centre through Grants #103-EC-17-A-25-1175 and #102-EC-17-A-02-02-1175. The authors also thank Mr. Black Hsu of TechMax Technical Group for his assistance in the thermal conductivity measurements.

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The authors declare no conflict of interest.

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Correspondence to J. K. Chen.

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Chen, J.K., Hung, H.Y., Wang, C.F. et al. Thermal and electrical conductivity in Al–Si/Cu/Fe/Mg binary and ternary Al alloys. J Mater Sci 50, 5630–5639 (2015). https://doi.org/10.1007/s10853-015-9115-9

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  • DOI: https://doi.org/10.1007/s10853-015-9115-9

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