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Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating

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Abstract

Electroless nickel-phosphorus plating is an important surface treatment method for copper due to its good corrosion resistance and nonmagnetic properties. However, a palladium activation procedure is needed owing to the inactiveness of copper to hypophosphite. Herein, nickel film, which could act as an activator, was deposited on copper through abnormal galvanic replacement deposition in the deep eutectic solvent containing nickel chloride in 10 min, which was 1/30 of the deposition time in other report (5 h). The open circuit potential tests proved that the practical potential of pure copper was obviously reduced to be lower than that of nickel in deep eutectic solvent, which made the deposition of nickel on copper through galvanic replacement reaction probable. It was remarkable that electroless nickel-phosphorus plating could be directly initiated by the as-prepared nickel film. The surface morphology, cross-sectional morphology, composition, and corrosion resistance of nickel-phosphorus coatings prepared on nickel and palladium films were characterized and compared. The results showed that the nickel-phosphorus coatings initiated by nickel and palladium films had similar morphology, composition, structure, and corrosion resistance. This result indicated that the nickel film prepared by galvanic replacement deposition possessed good activation ability to electroless nickel-phosphorus plating on copper, which was comparable to palladium film.

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Funding

This study was funded by the National Natural Science Foundation of China [51901233]; Youth Innovation Promotion Association CAS [2019412]; Science and Technology Planning Project of Lanzhou City [2019-RC-16]; and LICP Cooperation Foundation for Young Scholars [HZJJ20-02].

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Authors and Affiliations

  1. Key Laboratory of Science and Technology On Wear and Protection of Materials, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou, 730000, China

    Guanqun Hu & ** Zhao

  2. College of Physics and Electronic Engineering, Northwest Normal University, Lanzhou, 730070, China

    Rui Huang

  3. State Key Laboratory for Oxo Synthesis and Selective Oxidation, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou, 730000, China

    Hongli Wang

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  1. Guanqun Hu
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  2. Rui Huang
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  3. Hongli Wang
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  4. Qiu** Zhao
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  5. **ngkai Zhang
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    Correspondence to **ngkai Zhang.

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Hu, G., Huang, R., Wang, H. et al. Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating. J Solid State Electrochem 26, 1313–1322 (2022). https://doi.org/10.1007/s10008-022-05172-4

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  • DOI: https://doi.org/10.1007/s10008-022-05172-4

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