Abstract
Replication processes offer a number of considerable advantages for the production of micro components. This is not limited to the high economic efficiency achieved by numerous multiplications of master structures. Furthermore, micro devices can be produced of nearly every kind of material by one or a sequence of replication steps. In this contribution, five important processes of micro replication will be described, reflecting the wide variety from rapid prototy** over small and medium series to mass production. For future development, three main trends can be observed: the steady further miniaturization of sha** capability, the efforts to increase economic efficiency mainly by reducing cycle times and enlarging work areas, and the different approaches to combine sha** and joining procedures thus obtaining a minimum of process steps.
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00542-008-0572-9/MediaObjects/542_2008_572_Fig1_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00542-008-0572-9/MediaObjects/542_2008_572_Fig2_HTML.jpg)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00542-008-0572-9/MediaObjects/542_2008_572_Fig3_HTML.jpg)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00542-008-0572-9/MediaObjects/542_2008_572_Fig4_HTML.jpg)
Similar content being viewed by others
References
Bauer W, Knitter R (2002) J Mater Sci 37:3127–3140
Bauer W, Knitter R, Müller M, Ritzhaupt-Kleissl H-J (2006) Cfi/Ber. DKG 83 13:65–69
Bender M, Fuchs A, Plachetka U, Kurz H (2006) Status and prospects of UV-nanoimprint technology. J Microelectron Eng 83:827–830
Chou SY, Krauss P, Renstrom P (1995) Imprint of sub-25 nm vias and trenches in polymers. Appl Phys Lett67 (21)
Chou S, Krauss P, Zhang W, Guo L, Zhuang L (1997) Sub-10 nm imprint lithography and applications. J Vacuum Sci Technol 15, November/December, Nr. 6
Guo LJ (2007) Nanoimprint lithography: methods and material requirements. Adv Mater Nr 19:495–513
Elsebrock R, Makovica C, Meuffels P, Waser R (2004) Mater Lett 58:3348–3349
Fairley P (2003) 10 Emerging technologies that will change the World. Technology review, February
Hanemann T, Honnef K, Haußelt J (2007) Process chain development for the rapid prototy** of microstructured polymer, ceramic and metal parts: composite flow behaviour optimization, replication via reaction molding and thermal postprocessing. Intern J of Adv Manuf Techn 33:167–175
Heckele M, Schomburg WK (2004) Review on micro molding of thermoplastic polymers. J Mircomech Microeng 14:R1–R14
Hershey R, Miller M, Jones C, Ganapathi M, Lu X, Doyle G, Lentz D, LaBrake D (2006) PhotonicCrystal patterning for high volume LED manufacturing. proceedings of SPIE, sixth international conference on solid state lighting 6337, September
Knitter R, Bauer W, Göhring D, Haußelt J (2001) J Adv Eng Mater 3:49–54
Mehne C, Heckele M, Steger R, Warkentin D (2006) Hot embossing of large area microfluidic devices with through holes. In: 6th International Conference of the European Society for Precision Engineering and Nanotechnology (EUSPEN), Baden, A, May 28–June 1
Michaeli W, Opfermann D (2006) Micro assembly injection moulding. J Microsyst Technol 12:616–619
Pfleging W, Hanemann T, Torge M, Bernauer W (2003) Rapid fabrication and replication of metal, ceramic, and plastic mould inserts for application in microsystem technologies. J Mech Eng Sci Proc Instn Mech Engrs 217(Part C):53–63
Piotter V, Finnah G, Zeep B, Ruprecht R, Hausselt J (2007) Metal and ceramic micro components made by powder injection molding; materials science forum. Trans Tech Pub 534–536:373–376
Worgull M, Hetu J-F, Kabanemi KK, Heckele M (2006) Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication. Microsyst Technol 12(10–11):947–952
Acknowledgments
The authors would like to thank their colleagues for their friendly and always helpful cooperation. Additionally, the authors thank for the financial support by the European Commission within the 4 M-Network of Excellence, the BMBF and the Deutsche Forschungsgemeinschaft DFG (SFB 499).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Piotter, V., Bauer, W., Hanemann, T. et al. Replication technologies for HARM devices: status and perspectives. Microsyst Technol 14, 1599–1605 (2008). https://doi.org/10.1007/s00542-008-0572-9
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00542-008-0572-9