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A novel mask electrochemical additive and subtractive combined manufacturing technique for microstructures with high machining performance

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Abstract

In this paper, a novel mask electrochemical additive and subtractive combined manufacturing technique was proposed. This is a machining method at the atomic level, and it can be used to produce metal microstructures with high-profile accuracy and low surface roughness. Due to the accumulation of electric field lines during mask electrochemical deposition, the height of the edges of the microcolumns is usually twice or more than the height of the central position in the deposition plane. A combined machining method based on the electric-field constraint of the mask is thus proposed to improve the accuracy of the profile and its surface roughness. The feasibility of the proposed method was verified by both simulations and experiments. The height difference between the column center and the surrounding layer on the surface of nickel microcolumns was reduced from 13 to 2 µm, and the roughness of the tops of the microcolumns was also improved. Experiments to examine electrolysis leveling were carried out to verify the correctness of the results of the simulations and theoretical calculations. Finally, the parameters were optimized using orthogonal experiments, and an array of nickel microcolumns with a diameter of 200 µm and a height of nearly 50 µm was obtained using these optimal parameters. The profile accuracy and surface roughness of the high-precision microcolumn array were improved by using the mask electrochemical additive and subtractive combined machining technique, and a high-precision microcolumn array structure was manufactured.

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Data availability

The datasets used or analyzed during the current study are available from the corresponding author on reasonable request.

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References

  1. Liao Q, Li W, Liu H, Zhu L (2010) Fabrication of nanostructured electroforming copper layer by means of an ultrasonic-assisted mechanical treatment. Chin J Aeronaut 23(5):599–603. https://doi.org/10.1016/s1000-9361(09)60260-0

    Article  Google Scholar 

  2. Ren J, Zhu Z, Zhu D (2016) Effects of process parameters on mechanical properties of abrasive-assisted electroformed nickel. Chin J Aeronaut 29(4):1096–1102. https://doi.org/10.1016/j.cja.2016.05.001

    Article  Google Scholar 

  3. Zhang H, Zhang N, Fang F (2021) Study of ion transportation and electrodeposition under hybrid agitation for electroforming of variable aspect ratios micro structures. Precis Eng 72:122–143. https://doi.org/10.1016/j.precisioneng.2021.04.008

    Article  Google Scholar 

  4. Chen YL, Wang Y, Wang Y, Ju BF (2021) Meniscus-confined electrodeposition of metallic microstructures with in-process monitoring of surface qualities. Precis Eng 70:34–43. https://doi.org/10.1016/j.precisioneng.2021.01.011

    Article  Google Scholar 

  5. Daryadel S, Minary-Jolandan M (2020) Thermal stability of microscale additively manufactured copper using pulsed electrodeposition. Mater Lett 280:1258584. https://doi.org/10.1016/j.matlet.2020.128584

    Article  Google Scholar 

  6. Du LQ, Zhai K, Wang SX, Zhang X, Cao Q, Wen YK, Zhao WJ, Liu JS (2020) Evaluation of residual stress of metal micro structure electroformed with megasonic agitation. J Manuf Processes 59:629–635. https://doi.org/10.1016/j.jmapro.2020.10.010

    Article  Google Scholar 

  7. Mohammad AH, Mustafizur R (2013) Analysis of electrolyte flow in localized electrochemical deposition. Procedia Eng 56:766–771. https://doi.org/10.1016/j.proeng.2013.03.192

    Article  Google Scholar 

  8. Braun TM, Schwartz DT (2016) The emerging role of electrodeposition in additive manufacturing. Electrochem Soc Interface 25(1):69–73. https://doi.org/10.1149/2.F07161if

    Article  Google Scholar 

  9. Chandrasekar MS, Pushpavanam M (2008) Pulse and pulse reverse plating-conceptual, advantages and applications. Electrochim Acta 53:3313–3322. https://doi.org/10.1016/j.electacta.2007.11.05

    Article  Google Scholar 

  10. Zhao YF, Qian SQ, Zhang Y, Wan XF, Zhang H (2021) Experimental study on uniformity of copper layer with microstructure arrays by electroforming. Int J Adv Manuf Technol 114:2019–2030. https://doi.org/10.1007/s00170-021-06992-w

    Article  Google Scholar 

  11. Rajput MS, Pandey PM, Jha S (2015) Micromanufacturing by selective jet electrodeposition process. Int J Adv Manuf Technol 76:61–67. https://doi.org/10.1007/s00170-013-5470-3

    Article  Google Scholar 

  12. Zhao X, Jia ZX, Li W, Li Y, Kong QC (2018) Fabrication of optimized streamlined micro nozzles by hybrid electrochemical techniques. J Micromech Microeng 28:125006. https://doi.org/10.1088/1361-6439/aae818

    Article  Google Scholar 

  13. Li MJ, Luo WX, Chen YL, Cheng X (2021) Nickel micro-pillar mold produced by pulse and pulse-reverse current electrodeposition for nanoimprint lithography. Mater Lett 301:130310. https://doi.org/10.1016/j.matlet.2021.130310

    Article  Google Scholar 

  14. Zhu QS, Toda A, Zhang Y, Itoh T, Maeda R (2014) Void-free copper filling of through silicon via by periodic pulse reverse electrodeposition. J Electrochem Soc 161(5):D263–D268. https://doi.org/10.1149/2.073405jes

    Article  Google Scholar 

  15. West AC, Cheng CC, Baker B (1998) Pulse reverse copper electrodeposition in high aspect ratio trenches and vias. J Electrochem Soc 45(9):3070–3074. https://doi.org/10.1149/1.1838766

    Article  Google Scholar 

  16. Huang BC, Yang CH, Lee CY, Hu YL, Hsu CC (2019) Effect of pulse-reverse plating on copper: thermal mechanical properties and microstructure relationship. Microelectron Reliab 96:71–77. https://doi.org/10.1016/j.microrel.2019.04.004

    Article  Google Scholar 

  17. Tschulik K, Sueptitz R, Uhlemann M, Schultz L, Gebert A (2011) Electrodepositon of separated 3D metallic structures by pulse-reverse plating in magnetic gradient fields. Electrochim Acta 56:5174–5177. https://doi.org/10.1016/j.electacta.2011.03.051

    Article  Google Scholar 

  18. Narayanasamy M, Kirubasanakar B, Joseph A, Yan C, Angaiah S (2019) Influence of pulse reverse current on mechanical and corrosion resistance properties of Ni-MoSe2 nanocomposite coatings. Appl Surf Sci 493:225–230. https://doi.org/10.1016/j.apsusc.2019.06.239

    Article  Google Scholar 

  19. Yang H, Kang SW (2000) Improvement of thickness uniformity in nickel electroforming for the LIGA process. Int J Mach Tools Manuf 40:1065–1072. https://doi.org/10.1016/S0890-6955(99)00107-8

    Article  Google Scholar 

  20. Mekaru H, Kusuni S, Sato N, Shimizu M, Yamashita M, Shimada O, Hattori T (2007) Fabrication of a spiral microcoil using a 3D-LIGA process. Microsyst Technol 13(3–4):393–402. https://doi.org/10.1007/s00542-006-0202-3

    Article  Google Scholar 

  21. Flynn JM, Shokrani A, Newman ST, Dhokia V (2016) Hybrid additive and subtractive machine tools – research and industrial developments. Int J Mach Tools Manuf 101:79–101. https://doi.org/10.1016/j.ijmachtools.2015.11.007

    Article  Google Scholar 

  22. Masaki F, Chihiro L, Masaharu N (2009) One-step through-mask electrodeposition of a porous structure composed of manganese oxide nanosheets with electrocatalytic activity for oxygen reduction. Mater Res Bull 44(6):1323–1327. https://doi.org/10.1016/j.materresbull.2008.12.009

    Article  Google Scholar 

  23. Sankar PR, Khattak BQ, Jain AK, Kual R, Ganesh P, Nath AK, Tiwari P, Amban A, Pagare A (2013) Electroforming of copper by the periodic reversal process. Surf Eng 21(3):204–208. https://doi.org/10.1179/174329405X50028

    Article  Google Scholar 

  24. Luo JK, Chu DP, Flewitt AJ, Spearing SM, Fleck NA, Milne WL (2005) Uniformity control of Ni thin-film microstructures deposited by through-mask plating. J Electrochem Soc 152(1):C36. https://doi.org/10.1149/1.1833320

    Article  Google Scholar 

  25. Patel DS, Agrawal V, Ramkumar J (2020) Micro-texturing on free-form surfaces using flexible-electrode through-mask electrochemical micromachining. J Mater Proc Technol 282:116644. https://doi.org/10.1016/j.jmatprotec.2020.116644

    Article  Google Scholar 

  26. Wang JT, Xu ZY, Liu J, Tang XJ (2021) Real-time vision-assisted electrochemical machining with constant inter-electrode gap. J Manuf Processes 71:384–397. https://doi.org/10.1016/j.jmapro.2021.09.025

    Article  Google Scholar 

  27. Wang GQ, Li HS, Qu NS, Zhu D (2016) Investigation of the hole-formation process during double-sided through-mask electrochemical machining. J Mater Proc Technol 234:95–101. https://doi.org/10.1016/j.jmatprotec.2016.01.010

    Article  Google Scholar 

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Funding

This project is supported by the Project of Jiangsu Provincial Six Talent Peaks (Grant No. JXQC-009); the Foundation of State Key Laboratory of Digital Manufacturing Equipment and Technology (Grant No. DMETKF2022018).

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Authors and Affiliations

  1. School of Mechanical and Power Engineering, Nan**g Tech University, Nan**g, 211800, People’s Republic of China

    Yan Zhang, **nhao Deng, Chuandong Wu & Jie Zhang

  2. National Key Laboratory for Remanufacturing, Bei**g, People’s Republic of China

    Guofeng Han

Authors
  1. Yan Zhang
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  2. **nhao Deng
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  3. Chuandong Wu
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  4. Guofeng Han
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  5. Jie Zhang
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Contributions

All authors contributed to the study conception and design. Material preparation, data collection, and analysis were performed by Yan Zhang, **nhao Deng, Chuandong Wu, Guofeng Han, and Jie Zhang. The first draft of the manuscript was written by Chuandong Wu and all authors commented on previous versions of the manuscript. All authors read and approved the final manuscript.

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Correspondence to Yan Zhang.

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Zhang, Y., Deng, X., Wu, C. et al. A novel mask electrochemical additive and subtractive combined manufacturing technique for microstructures with high machining performance. Int J Adv Manuf Technol 124, 2863–2875 (2023). https://doi.org/10.1007/s00170-022-10644-y

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