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Processing performance of vitrified bonded fixed-abrasive lap** plates for sapphire wafers

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Abstract

To enhance the lap** effects of sapphire wafers, two vitrified bonded fixed-abrasive lap** plates with different mechanical properties were developed and used to lap sapphire wafers to evaluate the effects of lap** time and dressing cycle on the lap** process effect and the stability of the lap** plates. The results indicate that the lap** material removal rate (MRR) and surface roughness (Ra) of the workpiece decrease with increasing lap** time; the higher the hardness of the lap** plate, the larger the MRR and Ra. There are differences in the primary wear forms between the two types of plates, with the high-hardness plate being mainly abrasive wear and abrasive breakage, while the low-hardness plate being mainly abrasive peeling off and abrasive wear. The two plates have the same trend in material removal for sapphire wafers - increasing the lap** time, the MRR is found to be gradually decreased and plateaued after 30 min, which is only about 20% of that of the initial lap** time, resulting in the plates needing to be dressed. After dressing the lap** plates, the plate processing performance returns to its initial state; the MRR deviation is less than 10% within the same period of use after several dressings.

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Funding

The National Natural Science Foundation of China (No. 52175385 and No. U1801259) provided financial support.

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Authors and Affiliations

  1. School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, 510006, China

    Qiang **ong, **aowei Nie, Jiabin Lu, Qiusheng Yan & Jiayun Deng

Authors
  1. Qiang **ong
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  2. **aowei Nie
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  3. Jiabin Lu
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  4. Qiusheng Yan
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  5. Jiayun Deng
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Corresponding authors

Correspondence to Jiabin Lu or Qiusheng Yan.

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  • DOI: https://doi.org/10.1007/s00170-022-10294-0

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