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Ductile regime grinding of silicon nitride ceramics based on dynamic critical grinding depth

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Abstract

Considering both the grinding parameters and dynamic mechanical properties of the silicon nitride ceramics, the dynamic critical grinding depth model of the ductile regime grinding was established. The grinding experiment of the silicon nitride ceramics was carried out on a surface grinder MGK7120 × 6/F. The grinding force was compared with the critical load for the cracking, then the material removal mode was analyzed. The pixel mesh method was used to calculate the proportion of the brittle regime, and the material removal mode was further validated. The material removal mode of the silicon nitride ceramic grinding was predicted using the maximum undeformed grinding thickness model and dynamic critical grinding depth model. The predicted results were consistent with the results of the experimental analysis, and the correctness of the dynamic critical grinding depth model of the ductile regime grinding was verified. The mechanism of the grinding strain rate on the material removal mode was analyzed, and it was found that increasing the strain rate was conducive to achieving the ductile material removal, then improving the grinding quality. The research is useful to optimize the grinding parameters to reduce the damage in the ceramic grinding.

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Funding

The authors would like to thank the National Natural Science Foundation of China (grant no. 51505144), the Natural Science Foundation of Hunan Province (grant no. 2020JJ5178 and 2020JJ4024), the Scientific Research Fund of Hunan Provincial Education Department (grants no. 20A202), the Open Foundation of Hunan Key Laboratory of Design and Manufacture of Electromagnetic Equipment (grant no. DC201901), and the Open Foundation of Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Material (grant no. E21849) for the financial support.

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Wei Liu and Zhaohui Deng developed the idea for the study, Rentong Liu, Dubo Tang, Hao Gu, and Shun Liu did the analyses, and Dubo Tang and Wei Liu wrote the paper.

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Correspondence to Wei Liu.

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Liu, W., Tang, D., Liu, R. et al. Ductile regime grinding of silicon nitride ceramics based on dynamic critical grinding depth. Int J Adv Manuf Technol 121, 6431–6438 (2022). https://doi.org/10.1007/s00170-022-09741-9

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