Abstract
The electrodeposition of nanocrystalline Ni coatings from electroplating baths containing deep eutectic solvents (analogues of room-temperature ionic liquids) is studied. To improve physicochemical properties of electrolytes and enhance mechanical properties and corrosion resistance of Ni films, we suggest introducing extra water into plating baths based on a deep eutectic solvent. The effect of water addition on the electrodeposition of nickel coatings is investigated using an electrolyte containing choline chloride, ethylene glycol, nickel chloride and water in the molar ratio of 1: 2: 1: x where x is equal to 6, 9, 12, 15 or 18 (i.e., Ethaline + NiCl2 + xH2O). The introduction of water into the liquid mixture results in an increase in conductivity and a decrease in viscosity. The addition of extra water leads to more uniform and finer grained deposits. The electrodeposited Ni coatings with an average crystallite size of about 5 to 7 nm have an fcc crystal nanostructure. An increase in water content in the plating bath results in an increase in the microhardness of deposits and the inverse Hall–Petch effect is observed. According to electrochemical impedance spectroscopy measurements, the coatings with higher corrosion resistance are deposited from Ni plating bath containing water addition.
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Gorelov, S.M., Tsupak, T.E., Vinokurov, E.G., et al., Prot. Met. Phys. Chem. Surf., 2016, vol. 52, p. 622.
Ünal, H.I., Zor, S., Erten, U., and Gökergil, H.M., Prot. Met. Phys. Chem. Surf., 2015, vol. 51, p.600.
Danilov, F.I., Samofalov, V.N., Sknar, I.V., et al., Prot. Met. Phys. Chem. Surf., 2015, vol. 51, p.812.
Najafi Sayar, P., and Bahrololoom, M.E., J. Appl. Electrochem., 2009, vol. 39, p. 2489.
Orináková, R., Turonová, A., Kladeková, D., et al., J. Appl. Electrochem., 2006, vol. 36, p.957.
Hashemzadeh, M., Raeissi, K., Ashrafizadeh, F., and Khorsand, S., Surf. Coat. Technol., 2015, vol. 283, p.318.
Ma, C., Wang, S.C., and Walsh, F.C., Trans. Inst. Met. Finish., 2015, vol. 93, p.8.
Ma, C., Wang, S.C., and Walsh, F.C., Trans. Inst. Met. Finish., 2015, vol. 93, p.275.
Kumar, U.P., Kennady, C.J., and Zhou, Q., Surf. Coat. Technol., 2015, vol. 283, p.148.
El-Sherik, A.M. and Erb, U., J. Mater. Sci., 1995, vol. 30, p. 5743.
Dennis, J.K. and Such, T.E., Nickel and Chromium Plating, Elsevier, 2013, 2015.
Bicelli, L.P., Bozzini, B., Mele, C., and D’Urzo, L., Int. J. Electrochem. Sci., 2008, vol. 3, p.356.
Moti', E., Shariat, M.H. and Bahrololoom, M.E., J. Appl. Electrochem., 2008, vol. 38, p.605.
Smith, E.L., Abbott, A.P., and Ryder, K.S., Chem. Rev., 2014, vol. 114, p. 11060.
Abbott, A.P., Capper, G., Davies, D.L., et al., Chem. Commun., 2003, p.70.
Abbott, A.P., Capper, G., Davies, D.L., and Rasheed, R., Inorg. Chem., 2004, vol. 43, p. 3447.
Abbott, A.P., Ryder, K.S., and König, U., Trans. Inst. Met. Finish., 2008, vol. 86, p.196.
Gu, C.D., You, Y.H., Yu, Y.L., et al., Surf. Coat. Technol., 2011, vol. 205, p. 4928.
Srivastava, M., Yoganandan, G., and William Grips, V.K., Surf. Eng., 2012, vol. 28, p.424.
Gu, C. and Tu, J., Langmuir, 2011, vol. 27, p. 10132.
Abbott, A.P., El Ttaib, K., Ryder, K.S., and Smith, E.L., Trans. Inst. Met. Finish., 2008, vol. 86, p.234.
Abbott, A.P., Ballantyne, A., Harris, R.C., et al., Electrochim. Acta, 2015, vol. 176, p.718.
Shah, D. and Mjalli, F.S., Phys. Chem. Chem. Phys., 2014, vol. 16, p. 23900.
De Vreese, P., Brooks, N.R., Van Hecke, K., et al., Inorg. Chem., 2012, vol. 51, p. 4972.
McCalman, D.C., Sun, L., Zhang, Y., et al., J. Phys. Chem. B, 2015, vol. 119, p. 6018.
Du, C., Zhao, B., Chen, X.-B., et al., Sci. Rep., 2016, vol. 6, p. 29225.
Protsenko, V.S., Kityk, A.A., Shaiderov, D.A., and Danilov, F.I., J. Mol. Liq., 2015, vol. 212, p.716.
Bobrova, L.S., Danilov, F.I., and Protsenko, V.S., J. Mol. Liq., 2016, vol. 223, p.48.
Ali, M.R., Rahman, Md.Z., and Saha, S.S., Indian J. Chem. Technol., 2014, vol. 21, p.127.
Hall, E.O., Proc. Phys. Soc., Sect. B, 1951, vol. 64, p.747.
Petch, N.J., Acta Metall., 1964, vol. 12, p.59.
Wang, N., Wang, Z., Aust, K.T., and Erb, U., Mater. Sci. Eng., A, 1997, vol. 237, p.150.
Carlton, C.E. and Ferreira, P.J., Acta Mater., 2007, vol. 55, p. 3749.
Hamed, E., Abd El-Rehim, S.S., El-Shahat, M.F., and Shaltot, A.M., Mater. Sci. Eng., B, 2012, vol. 177, p.441.
Mulder, W.H. and Sluyters, J.H., Electrochim. Acta, 1988, vol. 33, p.303.
Rammelt, U. and Reinhard, G., Electrochim. Acta, 1990, vol. 35, p. 1045.
Wang, L., Zhang, J., Gao, Y., et al., Sci. Mater., 2006, vol. 55, p. 657.
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Danilov, F.I., Protsenko, V.S., Kityk, A.A. et al. Electrodeposition of Nanocrystalline Nickel Coatings from a Deep Eutectic Solvent with Water Addition. Prot Met Phys Chem Surf 53, 1131–1138 (2017). https://doi.org/10.1134/S2070205118010203
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DOI: https://doi.org/10.1134/S2070205118010203