Abstract
Metal network based transparent conducting electrodes are essential for the future optoelectronic devices due to their mechanical flexibility and compatible with large-scale manufacturing. In this report, we investigated the morphological, optical, electrical, and flexible properties of an electrodeposited silver (Ag) mesh transparent conducting electrodes based on a self-cracking template. An overly coated Ag mesh (ED-TE Ag mesh) was prepared onto glass and PET substrates by the sequential deposition steps including thermal evaporation and electroplating methods. The self-cracking template was lift-off prior to the over coating of Ag by the electrodeposition step. The surface morphologies of ED-TE Ag meshes are smooth and well interconnected. The Ag mesh thickness and line width are typically increased with the electroplating time from 0 s to 30 s. The ED-TE Ag mesh shows higher optoelectronic performance with a larger figure of merit (2827 (Ω/sq)−1) than the individual evaporated Ag mesh (756 (Ω/sq)−1) and the ITO film (311 (Ω/sq)−1). Moreover, the low sheet resistance (1.01 Ω/sq) of the ED-TE Ag mesh is observed at 30 s. The ED-TE Ag mesh exhibits almost stable resistance to both concave and convex bending tests, even at a smaller radius of curvature (<2 mm). Thus, these electrodes are more suitable for many flexible device applications like solar cells, displays, etc.
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This research was supported by the framework of the Research and Development Program of the Korea Institute of Energy Research (KIER C2-2401-01), the Basic Science Research Program through the National Research Foundation of Korea (NRF) that is funded by the Ministry of Science and ICT (Grant No. NRF-2021R1A2C1005815), and Regional Innovation Strategy (RIS) through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (MOE) (2021RIS-004).
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Kang, S., Arepalli, V.K., Yang, E. et al. High Performance and Flexible Electrodeposited Silver Mesh Transparent Conducting Electrodes Based on a Self-Cracking Template. Electron. Mater. Lett. 18, 440–446 (2022). https://doi.org/10.1007/s13391-022-00358-4
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DOI: https://doi.org/10.1007/s13391-022-00358-4