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Measurements of Enthalpies of Mixing of Sn–Ga–In Ternary Alloy System by Calorimetric Technique

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Abstract

The ultimate objective of this study is to find a way to replace toxic lead-based solder with a non-toxic replacement that retains all of the desirable characteristics of the conventional solder. In this work, the integral and partial enthalpy of mixing for Sn–Ga–In ternary alloy systems were measured by the help of drop calorimeter along six of the cross sections at different temperatures of 673 K, 723 K and 773 K. Pieces of pure tin were dropped into molten Ga0.25In0.75, Ga0.50In0.50, Ga0.75In0.25 alloys and pieces of pure Indium into Ga0.25Sn0.75, Ga0.50Sn0.50, Ga0.75Sn0.25. In order to calculate the interaction parameter, Redlich–Kister–Muggianu (RKM) model was used which considers the substitutional solution mechanism. Geometric models i.e. Kohler, Muggianu, Chou, Toop, and Hillert have been used to determine the integral mixing enthalpies and compared with experimental data. It has been seen a good agreement between the theoretical models and results of this study.

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Acknowledgements

The authors extend their thanks to the Head of the Department of Metallurgical Engineering at the Indian Institute of Technology (Banaras Hindu University), Varanasi, India, for providing essential support during the execution of this research.

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Authors and Affiliations

  1. Department of Metallurgical Engineering, Indian Institute of Technology (Banaras Hindu University), Varanasi, Uttar Pradesh, 221005, India

    Vikrant Singh, Dileep Pathote, Dheeraj Jaiswal, Kamalesh K. Singh & C. K. Behera

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Contributions

Vikrant Singh—Conceptualization, methodology, formal analysis, writing of the original draft. Dileep Pathote—Visualization, Dheeraj Jaiswal—Visualization. Kamalesh K. Singh and C.K. Behera—supervision and writing of the original draft.

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Correspondence to C. K. Behera.

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Singh, V., Pathote, D., Jaiswal, D. et al. Measurements of Enthalpies of Mixing of Sn–Ga–In Ternary Alloy System by Calorimetric Technique. Met. Mater. Int. (2024). https://doi.org/10.1007/s12540-024-01726-5

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